Mg-Containing Silver Paste for Solar Cell Contact Penetration
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Solution Overview
Problem
Conventional solar cell structures face challenges in achieving improved electrical performance, particularly in forming effective electrical contacts between conductive materials and semiconductor substrates, which affects the efficiency and reliability of solar cells.
Innovation Solution
A thick film composition comprising electrically conductive silver, glass frits, and an Mg-containing additive dispersed in an organic medium is applied to semiconductor substrates, whereupon firing, the organic medium is removed, and the silver and glass frits sinter to form an electrical contact with the substrate, enhancing the electrical performance of solar cells.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional metallization methods are used to form electrical contacts on semiconductor substrates, then the manufacturing process is simple, but the electrical performance and reliability of the contacts are insufficient
Solution Approach 1:
The patent uses a composite thick film composition containing silver particles, glass frit, and Mg-containing additive. The glass frit and MgO work together to penetrate the insulating film and form reliable electrical contacts, while the composite structure provides both mechanical adhesion and electrical conductivity, resolving the contradiction between contact reliability and composition simplicity.
Solution Approach 2:
The patent changes the chemical composition parameters by introducing Mg-containing additives (MgO, MgCO3, Mg(NO3)2) in specific amounts (0.1-10 wt%). This parameter change enables the composition to effectively penetrate insulating films and form reliable contacts, improving electrical performance while maintaining manageable complexity through controlled additive concentrations.
2Reliability
If the conductive composition is applied as a thick film to ensure effective penetration through insulating films, then the electrical contact performance improves, but the manufacturing precision and control become more difficult
Solution Approach 1:
The patent optimizes the firing temperature range (700-900°C) and composition ratios to achieve reliable penetration without excessive complexity. The Mg-containing additive facilitates penetration at controlled temperatures, and the glass frit composition is tuned to provide appropriate viscosity and reactivity, resolving the contradiction between penetration effectiveness and manufacturing control.
Solution Approach 2:
The glass frit acts as an intermediary material that facilitates penetration through the insulating film while maintaining process control. It provides a controlled chemical reaction pathway during firing, enabling the conductive composition to penetrate effectively without requiring extreme temperatures or complex processing conditions.
3Reliability
If the organic medium is completely removed during firing to achieve pure conductive contact, then the electrical performance improves, but the energy consumption and processing time increase
Solution Approach 1:
The patent optimizes the firing temperature range (700-900°C) and time to achieve complete organic medium removal while minimizing energy consumption. The composition is formulated to decompose and remove organics efficiently within this controlled parameter range, resolving the contradiction between contact purity and energy efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described method and composition improve the electrical contact between conductive materials and semiconductor substrates, leading to increased efficiency and reliability of solar cells by ensuring effective penetration and sintering of the conductive components, thereby enhancing the overall performance of solar cells.
Implementation Method 1
upon firing, the organic medium is removed
Implementation Method 2
the silver and glass frits sinter to form an electrical contact with the substrate
Implementation Method 3
the conductive silver and frit mixture penetrate the insulating film
Data Source
AI summary
Described herein are a silicon semiconductor device and a conductive silver paste for use in the front side of a solar cell device.