Magnesium Sputtering Target Bonding via Nickel Interlayer
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Solution Overview
Problem
The existing technologies fail to effectively improve the bonding strength between a magnesium (Mg) sputtering target and a backing plate, particularly when using magnesium as the target material, which affects sputtering efficiency due to issues like peeling and thermal stress during high-power sputtering.
Innovation Solution
A sputtering target-backing plate assembly is created by bonding a magnesium target to a Cu—Cr alloy backing plate using a layer of Ni or a Ni alloy as the interface material, formed through vapor deposition, with specific thickness and deposition amount ranges to enhance bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-power sputtering is performed to improve production efficiency, then sputtering efficiency is improved, but bonding strength between target and backing plate deteriorates due to thermal stress and peeling
Solution Approach 1:
A Ni or Ni-alloy interlayer is introduced between the Mg target and Cu-Cr backing plate. This interlayer acts as a mediator that improves bonding strength and prevents peeling during high-power sputtering, while maintaining thermal conductivity and electrical conductivity for efficient sputtering operation.
Solution Approach 2:
The assembly uses a composite structure combining Mg target, Ni or Ni-alloy interlayer, and Cu-Cr backing plate. This composite material approach leverages the advantages of each material: Mg for sputtering, Ni/Ni-alloy for bonding strength, and Cu-Cr for thermal and electrical conductivity.
2Device complexity
If Mg target is directly bonded to Cu-Cr alloy backing plate, then device complexity is reduced, but bonding strength deteriorates due to material incompatibility
Solution Approach 1:
A Ni or Ni-alloy interlayer is introduced between the Mg target and Cu-Cr backing plate. This interlayer acts as a mediator that improves bonding strength and prevents peeling during high-power sputtering, while maintaining thermal conductivity and electrical conductivity for efficient sputtering operation.
3Ease of manufacture
If conventional bonding methods are used without insert material, then manufacturing process is simplified, but bonding strength deteriorates leading to peeling during processing
Solution Approach 1:
A Ni or Ni-alloy interlayer is introduced between the Mg target and Cu-Cr backing plate. This interlayer acts as a mediator that improves bonding strength and prevents peeling during high-power sputtering, while maintaining thermal conductivity and electrical conductivity for efficient sputtering operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves a tensile strength of 3 kgf/mm2 or more at the bonded interface, preventing peeling and improving sputtering efficiency by ensuring compatibility and stability between the magnesium target and Cu—Cr alloy backing plate.
Implementation Method 1
the layer of Ni or an alloy comprising Ni as a main component is a layer that is formed by performing vapor deposition to Ni or an alloy comprising Ni as a main component
Implementation Method 2
these materials are loaded, and subsequently solid-phase diffusion is performed thereto
Data Source
AI summary
A sputtering target-backing plate assembly obtained by bonding a target material of Mg to a backing plate of Cu—Cr alloy, wherein the target material and the backing plate are bonded via a layer of Ni or an alloy comprising Ni as a main component at the interface therebetween. An object of the present invention is to provide a sputtering target-backing plate assembly that is used when magnesium (Mg) is the sputtering target material, and to resolve problems inherent in magnesium (Mg) and problems related to the selection of a backing plate to be compatible with magnesium by improving the bonding strength between the target and the backing plate in order to improve the sputtering efficiency.