Reciprocating Magnet Shielding for Uniform Sputtering Target Erosion
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Solution Overview
Problem
The uneven distribution of the magnetic field in sputtering apparatuses leads to non-uniform erosion of the sputtering target, affecting the deposition process and the lifespan of the target.
Innovation Solution
A sputtering apparatus is designed with a magnet module that includes a reciprocating magnet unit, a first shielding member attached to the magnet unit, a protective sheet with defined trenches, and a second shielding member with a fixed position between the back plate and the magnet module, all of which work together to improve the uniformity of the magnetic field and reduce erosion non-uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a magnet module is used to increase deposition rate, then productivity is improved, but the magnetic field distribution becomes uneven causing non-uniform erosion of the sputtering target
Solution Approach 1:
The patent introduces shielding members with different positions and configurations (first shielding member attached to magnet unit, second shielding member fixed between back plate and magnet module) to create locally adjusted magnetic field distributions. This allows the magnetic field to be optimized in different regions to achieve uniform plasma density and target erosion while maintaining high deposition rate.
2Manufacturing precision
If a magnet unit reciprocates to improve field distribution, then manufacturing precision is improved, but device complexity increases due to additional shielding members and positioning structures
Solution Approach 1:
The patent divides the shielding function into multiple segments: a first shielding member attached to the reciprocating magnet unit and a second shielding member fixed between the back plate and magnet module. This segmentation allows each shielding member to perform specific functions in different regions, achieving uniform magnetic field distribution while maintaining manageable structural complexity through modular design.
3Manufacturing precision
If shielding members are added to improve magnetic field uniformity, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The shielding members serve multiple functions: they modify magnetic field distribution to achieve uniformity, protect the back plate from plasma damage, and work in conjunction with the reciprocating magnet unit to maintain consistent plasma density. This multi-functionality reduces the need for additional separate components, balancing the improvement in manufacturing precision with acceptable device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved magnetic field uniformity results in more uniform erosion of the sputtering target, extending its lifespan and enhancing the consistency of the thin film deposition process.
Implementation Method 1
the magnetic field generated by a magnet module disposed adjacent to a sputtering target captures electrons to generate high-density plasma
Implementation Method 2
Sputtering is a main method of depositing a metal thin film on a substrate
Data Source
AI summary
A sputtering apparatus includes a back plate supporting a sputtering target, a magnet module disposed under the back plate and including a magnet unit reciprocating in a first direction, a first shielding member attached on a portion of the magnet unit, moving together with the magnet unit, and covering at least a portion of the magnet unit, a protective sheet disposed between the back plate and the magnet module, and a second shielding member disposed between the back plate and the magnet module, and having a fixed position.