Bracket-Based Magnet Wire Soldering on PCB
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Solution Overview
Problem
Existing methods for soldering insulated wires to printed circuit boards, particularly magnet wires with diameters smaller than a hair, are costly and inefficient due to the need for complex equipment like computer control systems and unsuitable wire guides.
Innovation Solution
A method involving a bracket with a through hole for aligning and securing the magnet wire, an auto-soldering tool with thermal contact portions, and a process of inserting the tool into the hole to solder the wire to a conductive pad on the printed circuit board, allowing for precise and efficient soldering without significant heat migration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a computer control system and wire guide unit are used to position insulated wire, then positioning precision is improved, but device complexity and cost increase significantly
Solution Approach 1:
The magnet wire's own magnetic properties are utilized to enable self-positioning on the circuit board. The wire naturally aligns and positions itself through magnetic attraction to the conductive pad, eliminating the need for external wire guide units and computer control systems for positioning.
Solution Approach 2:
The complex mechanical positioning system (computer control, wire guide unit, rotational scribing unit) is replaced by a magnetic field-based positioning mechanism. The magnetic properties of the wire replace the need for mechanical guidance and computer-controlled positioning mechanisms.
2Productivity
If a soldering tool with high heat energy is used to vaporize insulation quickly, then soldering speed is improved, but heat migration to the circuit board increases causing damage
Solution Approach 1:
The soldering tool is designed to concentrate heat energy locally at the contact point with the magnet wire. The heating element makes direct contact only with the wire portion that needs soldering, delivering intense localized heat to vaporize insulation and melt solder without significant heat diffusion to surrounding circuit board areas.
Solution Approach 2:
The circuit board is pre-coated with solder on the conductive pad before the soldering operation. This preliminary preparation ensures that when the heated tool contacts the wire, the pre-positioned solder is ready to melt and form a joint immediately, reducing the total time the heating element needs to be active and minimizing overall heat exposure to the board.
3Manufacturing precision
If conventional wire positioning methods are used, then positioning is achieved, but they are unsuitable for magnet wires with diameter less than a hair
Solution Approach 1:
The magnet wire's magnetic properties are exploited to enable self-positioning. The wire naturally attracts to and positions itself on the conductive pad through magnetic forces, eliminating the need for external positioning mechanisms that cannot handle such thin wires.
Solution Approach 2:
The positioning mechanism transitions from a planar mechanical guidance system to a three-dimensional magnetic field interaction. The magnetic field provides positioning forces in multiple dimensions, allowing the extremely thin wire to be accurately positioned without mechanical contact or guidance structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides a cost-effective and efficient means to solder soft wires to printed circuit boards, accommodating smaller magnet wires and reducing equipment costs while ensuring precise alignment and effective soldering.
Implementation Method 1
the quantum of heat energy in the tool being just sufficient (i) to vaporize insulation on the wire in the area of the contact point
Implementation Method 2
to then melt the solder on the solder coated terminal pad
Implementation Method 3
providing a soldering tool having a thermal contact portion; inserting said thermal contact portion into the through hole solder the magnet wire to the conductive pad
Data Source
AI summary
A method for soldering a soft wire to a printed circuit board conveniently includes the following step: providing a bracket having a through hole and an enameled wire; fastening the enameled wire to the bracket with the conductive wire crossing over the through hole; providing a printed circuit board formed with conductive pads thereon and setting the printed circuit board onto the bracket with the pad aligned to the through hole so that a portion of the magnet wire crossing the through hole lies on the conductive pad; providing a soldering tool having a thermal contact portion and inserting the thermal contact portion into the through hole to solder the magnet wire to the conductive pad.