Magnet-Wrapped Conductive Substrate Wiring for Dense Package Filtering
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Solution Overview
Problem
Existing manufacturing methods for magnet-based wiring in semiconductor packaging are complex, leading to low wiring density, high production costs, and poor yield due to repetitive grinding and alignment issues, which cannot meet the demands of high integration and miniaturization.
Innovation Solution
A method involving forming conductive holes in a core layer, creating a sacrificial copper layer, and etching to form metal and insulative posts, with a magnet wrapping around the metal posts, eliminating the need for additional insulating layers, using low resistivity and high thermal conductivity metals, and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If existing manufacturing mode of wiring with magnets is used, then the process can be completed, but the process becomes complex with long production cycle and low quality yield
Solution Approach 1:
The patent combines the formation of magnetic cavities and conductive posts into a single integrated process. The magnetic cavity formation and conductive post formation are merged into one step, eliminating the need for separate insulating layer formation and multiple alignment steps. This merging of processes directly reduces production cycle and simplifies the manufacturing process while maintaining wiring density and quality yield.
2Quantity of substance
If embedding mode is used for magnet formation, then the wiring can be formed, but the density of wiring with magnets is low
Solution Approach 1:
The patent applies preliminary action by forming the magnetic cavity and conductive post simultaneously in one process step. The magnetic material is deposited around the conductive post material in a single operation, creating the final high-density wiring structure without requiring subsequent embedding or alignment steps. This preliminary formation of the complete structure enables high wiring density while reducing manufacturing complexity.
3Reliability
If repetitive grinding and alignment steps are performed, then the wiring can be formed, but the production cost increases and yield decreases
Solution Approach 1:
The patent extracts and eliminates the repetitive grinding and alignment steps from the manufacturing process. By forming magnetic cavities and conductive posts in a single integrated process, the method removes the need for multiple alignment operations and grinding steps that previously reduced yield and increased cost. This extraction of unnecessary steps directly improves quality yield while reducing production cost.
4Device complexity
If additional insulating layers are formed around conductive posts, then the structure is complete, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges the functions of magnetic cavity formation and conductive post formation into one process step. The magnetic material is deposited around the conductive post material simultaneously, eliminating the need for separate insulating layer formation. This merging eliminates the alignment precision requirements between different layers while simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases wiring density, reduces production costs, and improves yield by directly forming magnetic cavities, enhancing reliability and thermal conductivity, aligning with high integration and miniaturization needs.
Implementation Method 1
forming a magnet wrapping around the metal post in an axial direction between the inner wall of the at least one first conductive hole and the metal post
Implementation Method 2
using low resistivity and high thermal conductivity metals, and simplifying the manufacturing process
Data Source
AI summary
A conductive substrate with a filtering function is manufactured by a process including preparing a core layer and forming first and second conductive holes in the core layer, forming a sacrificial copper layer on the first conductive hole and on the core layer, forming a metal layer on the second conductive hole, forming a metal post in the first conductive hole, forming a lower insulating layer on the core layer, forming a lower insulative post in the second conductive hole, forming a magnet wrapping around the metal post to obtain a first conductive post, forming an upper insulating layer on the core layer, forming an upper insulative post in the second conductive hole to obtain a second conductive post, removing the upper insulating layer, the lower insulating layer, and the remaining sacrificial copper post layer, followed by flattening.