Magnetic Adhesive for Stacked Semiconductor Chip Stability
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Solution Overview
Problem
The challenge in semiconductor packaging is to increase storage capacity while maintaining or reducing the size of electronic devices, which requires innovative methods for stacking and bonding multiple semiconductor chips without causing damage during the wire bonding process.
Innovation Solution
A semiconductor package design that incorporates a magnetic material layer in the adhesive member between stacked semiconductor chips, using a magnetic field to support the chips during bonding, preventing bending and potential damage by generating an attractive force that keeps the chips stable during the wire bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor chips are stacked in a vertical direction to increase storage capacity, then the storage capacity is improved, but the risk of chip damage during wire bonding process increases due to chip bending
Solution Approach 1:
A magnetic material layer is introduced as an intermediary between the adhesive member and the semiconductor chip. This magnetic material layer interacts with an external magnetic field to generate magnetic force that counteracts gravitational force and wire bonding-induced bending forces, thereby preventing chip damage during the wire bonding process while maintaining the stacked configuration for increased storage capacity
Solution Approach 2:
The physical state of the chip is changed by applying a magnetic field that generates magnetic force. By changing the force balance parameters (adding magnetic force to counteract gravity and bonding forces), the chip remains stable and resists bending during wire bonding, thus preventing damage while maintaining the vertical stacking configuration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents chip damage and ensures reliable bonding, enhancing the stability and integrity of the semiconductor package, thereby increasing storage capacity within a compact form factor.
Implementation Method 1
applying a magnetic field to the magnetic material layer so as to support the semiconductor chip
Implementation Method 2
the adhesive member has a magnetic material layer disposed therein
Data Source
AI summary
A semiconductor package includes a package substrate on which a substrate pad is disposed, a structure disposed over the package substrate, a semiconductor chip disposed over the structure using an adhesive member having a magnetic material layer disposed therein, a chip pad disposed on a top surface of the semiconductor chip, and a bonding wire coupling the substrate pad and the chip pad.