Magnetic Base Body Insulation for High-Pressure Particle Forming

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Solution Overview

Problem

High forming pressures in magnetic base bodies lead to the destruction of insulating films on metal magnetic particles, causing short circuits and increased eddy current loss, which is not effectively suppressed by existing techniques.

Innovation Solution

A magnetic base body with amorphous silicon oxide films of 100 nm or less in thickness, containing structural defects, is used to prevent the destruction of insulating films during high-pressure forming, ensuring the films deform with the metal magnetic particles and maintain insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the forming pressure is increased to raise the filling factor of metal magnetic particles, then the magnetic permeability is improved, but the insulating films on the metal magnetic particles are easily broken causing short circuits and increased eddy current loss

Engineering Contradiction:
Improvefilling factor of metal magnetic particlesVSAvoidintegrity of insulating films
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent changes the physical and chemical parameters of the insulating film by forming an amorphous silicon oxide film with specific thickness (1 nm to 100 nm) and introducing structural defects through controlled oxidation. These parameter changes enable the film to maintain insulation properties under high forming pressure while allowing sufficient particle packing density.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite structure consisting of metal magnetic particles combined with an amorphous silicon oxide insulating film. This composite material approach allows the system to simultaneously achieve high filling factor and maintained film integrity, as the silicon oxide film provides both insulation and structural stability during forming.

Inventive Principle:
Principle #40Composite materials

2Quantity of substance

If the insulating films are broken due to high forming pressure, then the metal magnetic particles can be densely packed, but eddy current loss increases due to short circuits between particles

Engineering Contradiction:
Improvefilling factor of metal magnetic particlesVSAvoideddy current loss
Core Design Contradiction:
Quantity of substanceVSLoss of energy

Solution Approach 1:

The patent controls the thickness and structural properties of the insulating film to optimize the balance between particle packing and eddy current suppression. The amorphous silicon oxide film with thickness of 1 nm to 100 nm and introduced structural defects provides sufficient electrical insulation to prevent short circuits while allowing dense particle arrangement for high filling factor.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If a thicker insulating film is used to prevent short circuits, then the film integrity is improved, but the filling factor of metal magnetic particles decreases

Engineering Contradiction:
Improveintegrity of insulating filmsVSAvoidfilling factor of metal magnetic particles
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent optimizes the insulating film thickness to a specific range (1 nm to 100 nm) and introduces structural defects through controlled oxidation processes. This parameter optimization achieves the right balance where the film is thick enough to provide insulation but thin enough to allow high particle filling factor, resolving the trade-off between film integrity and particle density.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses the destruction of insulating films, reducing eddy current loss and allowing for a higher filling factor of metal magnetic particles, thereby improving the magnetic permeability and mechanical strength of the magnetic base body.

Implementation Method 1

An insulating film is provided on the surface of each metal magnetic particles contained in the magnetic base body in order to prevent a short circuit between adjacent metal magnetic particles

Methodology Applied
Scientific EffectElectrical insulation: Electrical Resistance

Implementation Method 2

the amorphous silicon oxide film having a structural defect introduced therein... ensuring the films deform with the metal magnetic particles and maintain insulation

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Implementation Method 3

The magnetic base body for the electronic component is required to have high permeability... increase the filling factor of the magnetic particles in the magnetic base body to increase the magnetic permeability

Methodology Applied
Scientific EffectMagnetic permeability: Magnetic Field

Implementation Method 4

In these large-diameter particles, eddy current is easily generated. Therefore, if dielectric breakdown occurs between the metal magnetic particles in the magnetic base body, there occurs a problem that the eddy current loss increases

Methodology Applied
Scientific EffectEddy current: Eddy Currents

Data Source

PatentUS12165793B2Magnetic base body containing metal magnetic particles and electronic component including the same
Publication Date: 2024.12.10 TAIYO YUDEN KK
  • US12165793B2 patent drawing
  • US12165793B2 patent drawing
  • US12165793B2 patent drawing

AI summary

A magnetic base body according to an embodiment of the present invention includes a metal magnetic particle and an amorphous silicon oxide film provided on a surface of the metal magnetic particle, the amorphous silicon oxide film having a structural defect introduced therein.