Magnetic Blocks for Thermal Coupling Removable Devices
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Solution Overview
Problem
Removable devices such as SFP transceivers and NVMe storage drives generate excessive waste heat during operation, which can lead to performance degradation, reliability issues, and potential failure if not adequately dissipated, and existing thermal management solutions face challenges in maintaining optimal thermal communication due to surface imperfections and risk of damaging pressure-sensitive components.
Innovation Solution
The electronic system employs a cooling component with magnetic blocks that align with magnetic blocks on the removable device's heat spreader to establish thermal communication, using controlled magnetic forces to prevent load transfer to sensitive components and maintain optimal resistive forces during connection and disconnection, thereby ensuring effective heat dissipation without damaging the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If adequate thermal communication is established between cooling component and heat spreader, then heat dissipation effectiveness is improved, but surface imperfections and misalignment prevent optimal thermal contact
Solution Approach 1:
The magnetic blocks are pre-positioned on both the cooling component and heat spreader before assembly. When the components are brought together, the magnetic attraction automatically pulls the surfaces into close contact, preliminarily establishing optimal thermal communication pathways before final assembly constraints are applied.
Solution Approach 2:
The patent replaces traditional mechanical fastening and pressing mechanisms with magnetic attraction to establish thermal contact. The magnetic force between opposing magnetic blocks eliminates the need for complex mechanical pressure application systems, achieving consistent surface contact through field-based attraction.
2Loss of energy
If sufficient pressure is applied to ensure thermal contact, then thermal communication is improved, but pressure-sensitive components may be damaged
Solution Approach 1:
The magnetic blocks serve as intermediary elements between the cooling component and heat spreader. They transmit the necessary attractive force to establish thermal contact through the TIM layer while distributing the stress away from sensitive electronic components, allowing sufficient pressure for thermal contact without direct compression of delicate parts.
Solution Approach 2:
The patent changes the method of force application from direct mechanical compression to magnetic attraction. This parameter change allows the system to achieve the necessary contact pressure for thermal communication while maintaining distributed, controlled forces that do not concentrate stress on vulnerable components.
3Ease of manufacture
If reusable thermal interface material is used, then assembly is simplified and cost is reduced, but thermal conductivity may be insufficient compared to non-reusable materials
Solution Approach 1:
The reusable thermal interface material is pre-applied to the cooling component surface before assembly. The magnetic attraction then automatically presses this pre-positioned material into optimal contact with the heat spreader, ensuring sufficient thermal conductivity is achieved through the reusable material without requiring complex application procedures or expensive proprietary materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages thermal communication between the host device and removable device, preventing load transfer to sensitive components and ensuring safe and efficient heat dissipation, thereby enhancing the performance, reliability, and lifespan of the removable device.
Implementation Method 1
magnetic forces applied by at least one of the plurality of first blocks or second blocks to couple respective blocks to each other
Implementation Method 2
the first surface is in thermal communication with the second surface via the interface material
Data Source
AI summary
Example implementations relate to an electronic system providing a thermal management of a removable device when connected to a host device of the electronic system. The host device includes a cooling component having a first surface, and a plurality of first blocks of magnetic materials coupled to the cooling component. The removable device includes a heat spreader having a second surface, a plurality of second blocks of magnetic materials coupled to the heat spreader, and a TIM disposed on the second surface. The removable device is detachably connectable to the host device. When the removable device is connected to the host device, and magnetic forces applied by at least one of the first blocks or second blocks to couple respective blocks to each other, the first blocks is aligned with the second blocks such that the first surface is in thermal communication with the second surface through the TIM.