Magnetic Self-Alignment Chip Packaging Fixture
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Solution Overview
Problem
Conventional micro-chip packaging methods, such as flip-chip bonding, are expensive and inefficient due to the need for robotic arms and precise alignment, especially for thin substrates like RFID tags, where Fluidic Self Assembly (FSA) technology is difficult and costly to implement.
Innovation Solution
A self-aligning chip packaging fixture using magnetic fields to align chips and substrates, comprising a magnetic device, substrate transfer device, and chip conveyor, where the magnetic device provides a self-alignment magnetic field and the substrate transfer device ensures precise alignment of bonding points with rollers and a stepping controller, allowing for efficient and cost-effective bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional robotic arm methods are used for flip-chip bonding, then alignment precision can be achieved, but equipment cost and device complexity increase significantly
Solution Approach 1:
The patent replaces the mechanical robotic arm system with a magnetic field-based self-alignment system. Magnets are embedded in both the chip and substrate, creating magnetic attraction forces that automatically align the bonding points without requiring complex mechanical positioning devices. This substitution of mechanical systems with magnetic fields directly resolves the contradiction by achieving alignment precision while dramatically reducing equipment complexity.
Solution Approach 2:
The magnetic field system enables self-alignment where the chip and substrate automatically position themselves through magnetic attraction. The bonding points with embedded magnets naturally seek each other out and align without external control or intervention. This self-service mechanism eliminates the need for expensive robotic arms and control systems while maintaining high alignment precision.
2Manufacturing precision
If robotic arm methods are used for chip bonding, then alignment can be controlled, but processing speed and productivity decrease due to sequential operation
Solution Approach 1:
The magnetic self-alignment system allows multiple chips to be bonded simultaneously through automatic magnetic attraction. Each chip with embedded magnets automatically finds and bonds to its corresponding substrate position without sequential control, enabling parallel processing and dramatically improving productivity while maintaining alignment control.
Solution Approach 2:
Magnets are pre-embedded in the chip and substrate bonding points during manufacturing. This preliminary action ensures that when the chip and substrate are brought into proximity, the magnetic attraction immediately guides them into correct alignment and enables bonding without requiring real-time control adjustments, thus improving both precision and speed.
3Device complexity
If FSA technology is used for self-alignment, then equipment cost can be reduced, but it requires substrate openings and is difficult to implement for thin substrates like RFID tags
Solution Approach 1:
The patent replaces the fluid-based FSA mechanical system with a magnetic field system. Instead of requiring substrate openings and fluid manipulation, magnets are simply embedded in the bonding points. This substitution makes the system adaptable to thin substrates like RFID tags that cannot accommodate FSA requirements, while maintaining equipment simplicity.
Solution Approach 2:
The invention changes the fundamental parameter of alignment from fluid-based physical contact (FSA) to magnetic field interaction. This parameter change allows the system to work with thin substrates that are incompatible with FSA, as magnetic fields can penetrate and act on chips without requiring physical openings or thick substrate structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The magnetic field-based self-aligning fixture significantly reduces packaging costs and improves efficiency by simplifying the process and enabling accurate alignment without the need for expensive robotic equipment, enhancing the bonding process for small chips and substrates like RFID tags, diodes, and LEDs.
Implementation Method 1
achieve a chip and substrate self-aligning bond under magnetic field attraction
Data Source
AI summary
A method and fixture using magnetic field assisted self-alignment for chip packaging. Typical embodiments include a magnetic device having one or more pole groups, each pole group including two or three poles. Some embodiments provide multiple pole groups arranged in a one or two dimensional pole group array. The poles can build up a self-alignment magnetic field. The structure of fixture is simple and easy to implement. Typical embodiments can greatly reduce chip packaging cost and make packaging more efficient. In accordance with typical embodiments, a chip and a substrate can be self-aligned magnetically regardless of their shapes.