Magnetically Guided Chiplet Displacement for Precision Placement
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Solution Overview
Problem
Current technologies face challenges in achieving precise placement of chiplets, such as light emitting diodes (LEDs), on receiving substrates with high resolution and throughput while maintaining low costs, particularly in forming individual pixels for high-resolution display technology.
Innovation Solution
The method employs magnetic regions on chiplets or receiving substrates to enable magnetically guided precision placement, using a scanning magnetic head to transfer chiplets from a temporary support substrate to bond pads on the receiving substrate, creating a controlled magnetic moment for precise alignment and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temporary bonding and release of singulated LED containing chiplets is used, then throughput can be maintained, but placement precision is lacking
Solution Approach 1:
The patent replaces mechanical bonding and release systems with a magnetic field-based system. Magnetic regions on the temporary support substrate and receiving substrate enable precise chiplet placement through magnetic attraction, eliminating the need for mechanical temporary bonding processes while maintaining high throughput production capabilities
Solution Approach 2:
The patent utilizes magnetic field strength as a controllable parameter to achieve precise placement. By adjusting magnetic field parameters and the interaction between magnetic regions, the system can precisely control chiplet positioning on the receiving substrate without compromising production speed
2Manufacturing precision
If high resolution display technology using multiple colored micro-LEDs is fabricated, then display quality is improved, but chiplet placement precision requirements increase difficulty and cost
Solution Approach 1:
The magnetic field-based placement system eliminates complex mechanical positioning mechanisms, reducing manufacturing complexity and cost while achieving the high precision required for high-resolution display fabrication with multiple colored micro-LEDs
Solution Approach 2:
The magnetic region system serves multiple functions: it provides precise positioning, enables controlled release from temporary substrate, and facilitates accurate alignment with bond pads. This multi-functionality reduces the need for separate precision mechanisms, simplifying the overall manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise and efficient placement of chiplets with controlled orientation, enabling the formation of high-resolution displays with multiple colored micro-LEDs, addressing the need for high throughput and low-cost precision placement.
Implementation Method 1
a preselected number of chiplets of the first structure are transferred to the bond pads of the second structure utilizing magnetic force of attraction
Implementation Method 2
a magnetic moment of a controlled orientation exists between the transferred chiplets and the receiving substrate
Data Source
AI summary
Magnetic regions of at least one of chiplet or a receiving substrate are used to permit magnetically guided precision placement of chiplets on the receiving substrate. In some embodiments, a scanning magnetic head can be used to release individual chiplets from a temporary support substrate to the receiving substrate. Structures are provided in which a magnetic moment of a controlled orientation exists between the transferred chiplets and the receiving substrate.