Display Device Heat Dissipation via Magnetic Chip on Film Attachment

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Solution Overview

Problem

Liquid crystal display devices face overheating issues due to the heavy operation of data driver and gate driver integrated circuits, which can lead to reduced productivity and device lifespan.

Innovation Solution

Incorporating a connection unit with magnets that affixes a chip on film to the housing chassis, allowing heat generated by the driver integrated circuits to be dissipated effectively to the housing chassis, thereby reducing overheating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If driver integrated circuits operate heavily to drive data signals and gate signals, then display device functionality is improved, but heat generation increases causing overheating

Engineering Contradiction:

Improvedisplay device functionalityVSAvoidheat generation

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent converts the harmful heat generated by driver integrated circuits into a beneficial cooling mechanism by using magnets with high thermal conductivity to transfer heat from the ICs to the housing chassis, which acts as a heat sink, thus transforming the harmful thermal energy into a controlled heat dissipation process

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent introduces magnets as intermediary components between the driver integrated circuits and the housing chassis. These magnets serve dual functions: providing mechanical attachment and acting as thermal conduits to transfer heat from the ICs to the chassis, which then dissipates heat to the surrounding environment

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If driver integrated circuits are mounted on chip on film, then device integration is improved, but heat dissipation becomes more difficult

Engineering Contradiction:

Improvedevice integrationVSAvoidheat dissipation

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The patent makes the housing chassis multi-functional by giving it both structural support and heat dissipation functions. The chassis serves as the device enclosure while simultaneously acting as a heat sink that receives and dissipates heat from the driver integrated circuits, eliminating the need for separate cooling components

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The magnets serve as intermediary components that bridge the chip on film with the housing chassis, providing both mechanical attachment and thermal conduction pathways, thus enabling heat to travel from the integrated circuits through the magnets to the chassis for dissipation

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If connection unit uses magnets to affix chip on film, then attachment strength is improved, but heat dissipation path is added

Engineering Contradiction:

Improveattachment strengthVSAvoidheat dissipation path

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The magnets in the connection unit are designed to perform multiple functions simultaneously: providing strong magnetic attachment to hold the chip on film in place and serving as thermal conduits to conduct heat from the driver integrated circuits to the housing chassis for dissipation

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the attachment function and heat dissipation function into a single integrated solution using magnets. The connection unit that mechanically attaches the chip on film to the chassis also provides the thermal pathway for heat dissipation, combining two separate requirements into one component

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively dissipates heat from the driver integrated circuits, increasing their lifespan and maximizing the productivity of the display device by preventing overheating.

Implementation Method 1

the connection unit includes a magnet... the magnet may affix the chip on film to the housing chassis

Methodology Applied

Scientific EffectMagnetic force: Magnetism

Implementation Method 2

a connection unit attaching the chip on film to the housing chassis and dissipating heat generated by the driver integrated circuit to the housing chassis

Methodology Applied

Scientific EffectHeat dissipation: Conduction (thermal)

Data Source

PatentUS8988645B2Display devices

Publication Date: 2015.03.24 SAMSUNG ELECTRONICS CO LTD

AI summary

A display device includes a panel including pixels defined by data lines and gate lines, a housing chassis covering a sidewall and an edge of the panel, a printed circuit board under the panel, the printed circuit board including circuit elements configured to generate at least one of a data signal, a gate signal, and a control signal, a chip on film connecting the printed circuit board to the panel, the chip on film between the housing chassis and the sidewall of the panel, a driver integrated circuit mounted on the chip on film and configured to respond to the control signal and drive at least one of the data signal and the gate signal applied to the data lines and the gate lines, and a connection unit attaching the chip on film to the housing chassis and dissipating heat generated by the driver integrated circuit to the housing chassis.