Magnetic Coil Layout for Reflow Crack-Resistant Inductors
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Solution Overview
Problem
Conventional coil components with metal-composite magnetic base bodies face issues with water evaporation during the reflow process, leading to micro cracks and reduced inductance due to uneven water vaporization routes, which can result in lower inductance and reliability.
Innovation Solution
A coil component design featuring a magnetic base body with a coil conductor that has alternating first and second conductor portions, where the distance between the first conductor portions and the first surface is less than the distance between the second conductor portions and the second surface, allowing for more uniform water movement and reducing the likelihood of micro cracks by balancing resistance against water movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a metal-composite magnetic base body containing water is used, then the base body can be formed by conventional manufacturing processes, but water evaporates during reflow causing micro cracks and reduced reliability
Solution Approach 1:
The patent removes water from the magnetic base body by replacing it with a solvent that has higher boiling point and lower vapor pressure than water, preventing water evaporation during reflow soldering and subsequent micro crack formation
Solution Approach 2:
The patent changes the physical and chemical parameters of the liquid component by substituting water with a specific solvent having different properties (higher boiling point, lower vapor pressure), thereby eliminating the harmful evaporation effect during high-temperature processing
2Quantity of substance
If water moves through limited routes in the magnetic base body, then evaporation occurs, but pressure rises creating micro cracks
Solution Approach 1:
The patent converts the harmful effect of water evaporation into a beneficial outcome by using a solvent that does not evaporate, thereby preventing micro crack formation while still allowing liquid movement through the magnetic base body for manufacturing purposes
3Ease of manufacture
If the coil conductor is positioned closer to one surface, then winding is simplified, but water evaporation follows uneven routes reducing inductance
Solution Approach 1:
By removing water from the system and replacing it with a non-evaporating solvent, the patent eliminates the problem of uneven evaporation routes, allowing the coil conductor to be positioned optimally for both manufacturing ease and inductance precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents water from exclusively following specific routes, reducing the risk of micro cracks and maintaining high inductance and magnetic saturation characteristics, thus enhancing the reliability of the coil components.
Implementation Method 1
a binder binding together the metal magnetic particles
Implementation Method 2
the water contained within the magnetic base body to move to the surface of the magnetic base body and eventually evaporate into the air through the surface of the magnetic base body
Data Source
AI summary
A coil component includes a base body containing metal magnetic particles and a binder binding together the metal magnetic particles and having a first surface extending along a coil axis and a second surface opposing the first surface, a first external electrode, a second external electrode, and a coil conductor electrically connected to the first and second external electrodes. In one embodiment, the coil conductor has a winding portion, the winding portion has first conductor portions and one or more second conductor portions smaller in number than the first conductor portions. The first and second conductor portions alternate with and are connected to each other. A first dimension of the base body representing a dimension between the first surface and the second surface is greater than a second dimension of the base body representing a dimension of the base body between the third and fourth surface.