Magnetic Collet Structure for Interference-Free Chip Pick-Up
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Solution Overview
Problem
Existing semiconductor chip pick-up systems face challenges with interference between chips and parts due to complex collet structures, leading to inefficiencies and increased risk of process errors during the dicing and transfer processes.
Innovation Solution
A collet structure comprising a holder, a plate, and an absorption member, where the holder and plate are magnetically and mechanically combined, with integral vacuum provision and edge contact design to prevent chip interference, allowing for efficient pick-up of semiconductor chips of various sizes without additional assembly processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a complex collet structure is used to pick up semiconductor chips, then the pick-up capability is improved, but interference between chips and parts occurs leading to process errors
Solution Approach 1:
The collet structure is divided into separate functional components: a holder for structural support, a plate for vacuum distribution, and an absorption member for chip contact. This segmentation allows each component to be optimized independently, reducing interference while maintaining pick-up capability
Solution Approach 2:
The magnet is extracted as a separate component embedded in the holder rather than integrated into the absorption member. This separation prevents magnetic interference with adjacent chips while maintaining effective pick-up of the target chip through the vacuum system
2Manufacturing precision
If a complex collet structure with multiple parts is used, then pick-up precision is improved, but the structure complexity increases requiring periodic part exchange
Solution Approach 1:
Multiple functions are merged into the holder component: structural support, magnet embedding, and vacuum reception. This consolidation reduces the number of replaceable parts while maintaining pick-up precision through the integrated design
Solution Approach 2:
The holder serves multiple purposes: providing structural support, housing the magnet for chip attraction, and receiving vacuum to transmit through the plate to the absorption member. This multi-functionality reduces overall system complexity and eliminates periodic part exchange
3Stability of the object's composition
If the holder size is increased to accommodate complex structures, then pick-up stability is improved, but interference with adjacent chips and parts increases
Solution Approach 1:
The absorption member features localized vacuum application at specific contact regions rather than uniform distribution. This allows stable pick-up of the target chip through concentrated vacuum force while minimizing the holder's footprint and interference with adjacent chips
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the efficiency of the pick-up process, improves productivity, and reduces the likelihood of process errors by ensuring precise chip handling and compatibility with different chip sizes, while eliminating the need for additional assembly steps.
Implementation Method 1
The holder may be configured to downwardly receive vacuum
Implementation Method 2
The plate may include an upper surface magnetically and mechanically combined with the holder
Data Source
AI summary
A semiconductor fabricating apparatus may include a collet structure configured to pick-up a semiconductor chip. The collet structure may include a holder, a plate, an absorption member and an edge contact. The holder may be configured to downwardly receive vacuum. The holder may include a magnet arranged in the holder. The plate may include an upper surface magnetically and mechanically combined with the holder. The plate may include a sidewall wholly exposed by the holder. The plate may receive the vacuum from the holder. The absorption member may make contact with the plate to pick-up the semiconductor chip using the vacuum received from the plate. The edge contact may include a protrusion having a first length protruded from an edge portion of a bottom surface of the holder to make contact with the plate.