Magnetic Collet Structure for Flat-Surface Chip Vacuum Pickup
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Solution Overview
Problem
Conventional magnetic collets are unable to function properly on collet holders with flat contact surfaces, as they require a common groove for effective vacuum suction, and their design complicates the replacement process for different chip sizes.
Innovation Solution
A magnetic collet design featuring adsorption rubber with individual holes and a metal plate with a common hole, allowing for vacuum suction force distribution and enabling operation on flat contact surfaces, along with a replaceable structure for the adsorption rubber and metal plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a common groove is provided in the contact surface of the collet holder, then vacuum suction force can be properly applied to adsorb the semiconductor chip, but the collet holder structure becomes more complex and cannot be applied to flat contact surfaces
Solution Approach 1:
The invention divides the vacuum suction system into two independent parts: the collet holder with a single hole and the magnetic collet with multiple holes. This segmentation eliminates the need for a common groove in the collet holder, allowing flat contact surfaces while maintaining vacuum suction functionality through the magnetic collet's hole structure.
2Ease of manufacture
If the magnetic collet is designed as an integrated structure, then manufacturing is simpler, but replacement for different chip sizes becomes difficult
Solution Approach 1:
The magnetic collet is divided into separable components (adsorption rubber and metal plate) that can be independently replaced. This allows the adsorption rubber to be changed for different chip sizes while keeping the metal plate structure intact, providing versatility without complicating manufacturing.
Solution Approach 2:
The invention introduces a dynamic replacement mechanism where the adsorption rubber can be detached and reattached to the metal plate. This dynamic structure enables easy adaptation to different chip sizes by simply changing the adsorption rubber component.
3Reliability
If multiple holes are provided in the magnetic collet, then vacuum suction can be distributed for better chip adsorption, but the structure becomes more complex
Solution Approach 1:
The multiple holes are integrated into the magnetic collet component itself rather than requiring multiple separate structures. This segmentation approach distributes vacuum suction through multiple holes in a single component, improving chip adsorption stability without proportionally increasing overall structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The magnetic collet can perform semiconductor chip transfer functions on flat contact surfaces without additional grooves, ensuring stable chip attachment and transfer while allowing for easy replacement of components to accommodate various chip sizes.
Implementation Method 1
a vacuum supply tube provided with a hole through which air is suctioned so as to provide a vacuum suction force to the semiconductor chip
Implementation Method 2
a collet holder to have a magnetic force so that a collet in which adsorption rubber is coupled to a metal plate may be coupled to the collet holder
Data Source
AI summary
Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.