Magnetic-Matrix Component Carrier for High-Inductance EMI Shielding
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Solution Overview
Problem
Conventional component carriers face challenges with low inductance values, high production costs, and high ohmic resistances, while also needing efficient heat dissipation and protection against electromagnetic interference (EMI) as they become more miniaturized and integrated with powerful array-like components.
Innovation Solution
A component carrier design featuring a structured electrically conductive layer embedded in a magnetic matrix, where the inductive element is partially or fully surrounded by the magnetic matrix, enhancing inductance and providing efficient electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional approaches are used to integrate magnetic material in a component carrier, then inductance can be provided for specific applications, but the inductance values are low and production costs are high
Solution Approach 1:
The magnetic material is embedded within the component carrier layer structure, with the inductive element nested inside the magnetic material. This nested configuration allows the inductive element to be fully surrounded by magnetic material, maximizing inductance value while using a single integrated structure that reduces production complexity and cost
Solution Approach 2:
The invention uses a composite structure combining electrically conductive material (for the inductive element) and magnetic material (for enhancement) within a component carrier layer structure. This composite approach enables high inductance values while maintaining manufacturing efficiency through integrated layer construction
2Quantity of substance
If conventional approaches are used to integrate magnetic material in a component carrier, then inductance can be provided for specific applications, but ohmic resistances are high
Solution Approach 1:
The inductive element is nested inside the magnetic material, allowing the magnetic flux to be concentrated around the conductive path. This configuration reduces magnetic reluctance and improves coupling efficiency, thereby reducing effective ohmic resistance while maintaining high inductance
Solution Approach 2:
The composite structure of conductive inductive element surrounded by magnetic material creates an optimized magnetic circuit that reduces energy losses and effective resistance, improving overall electrical reliability
3Adaptability or versatility
If component carriers are miniaturized with more electronic components and smaller spacing, then product functionality increases, but heat dissipation becomes increasingly difficult
Solution Approach 1:
The magnetic material serves as an intermediary structure that can be configured to provide thermal management pathways. The layered structure with magnetic material embedded between circuit layers creates additional interfaces and pathways for heat dissipation, allowing efficient thermal management in miniaturized designs
4Adaptability or versatility
If component carriers are miniaturized with more electronic components and smaller spacing, then product functionality increases, but protection against electromagnetic interference becomes increasingly difficult
Solution Approach 1:
The magnetic material completely surrounds the inductive element, creating a nested configuration that provides inherent EMI shielding. This enclosed magnetic structure contains magnetic flux within the component carrier, preventing electromagnetic interference from affecting other components while maintaining miniaturization
Solution Approach 2:
The composite structure combining conductive and magnetic materials creates an integrated EMI protection solution. The magnetic material layer acts as a shield, while the conductive elements provide circuit functionality, achieving both miniaturization and EMI protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves higher inductance values with lower ohmic resistance and cost-effective manufacturing, while ensuring mechanical robustness and effective EMI protection, suitable for harsh conditions.
Implementation Method 1
a magnetic matrix (for example a magnetic sheet, a magnetic film or magnetic paste) embedded in the stack, wherein the magnetic matrix (at least partially) (in particular fully) surrounds (encloses) the inductive element
Data Source
AI summary
A component carrier includes a stack with at least one electrically insulating layer structure, a structured electrically conductive layer assembled to the stack, where a part of the structured electrically conductive layer is configured as an inductive element, and a magnetic matrix embedded in the stack. The magnetic matrix at least partially surrounds the inductive element. Further, a manufacturing method is described.