Composite Magnetic Component Marking for Thickness-Free Identification
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Solution Overview
Problem
Existing electronic components require complex post-assembly marker attachment to identify front and rear, and markers with thickness complicate automatic inspection, making identification difficult.
Innovation Solution
An electronic component with a marker area formed by non-conductive particles buried in a composite magnetic layer, allowing for easy identification without thickness, and a manufacturing method involving compression molding to integrate the marker layer with the component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a marker is attached after the completion of the electronic component, then the marker can be identified, but the work becomes complicated and time-consuming
Solution Approach 1:
The marker layer is formed during the manufacturing process of the electronic component itself, specifically by applying a slurry containing non-conductive particles to the green body before sintering. This preliminary formation of the marker eliminates the need for separate post-assembly marker attachment operations, thereby simplifying the overall process while maintaining identification capability.
2Ease of manufacture
If a marker is engraved by punching, then the marker can be formed, but the color difference and contrast are small making it difficult to recognize with inspection cameras
Solution Approach 1:
The marker layer is formed by applying a slurry containing non-conductive particles that create a distinct visual contrast with the surrounding magnetic layer. After sintering, the marker area exhibits different color and surface characteristics compared to the base material, making it easily recognizable by automatic inspection cameras without requiring high-contrast engraving.
Solution Approach 2:
The marker layer is created as a composite structure with non-conductive particles embedded in a glass frit matrix, which is then integrated into the magnetic layer. This composite approach provides both mechanical integrity and optical contrast, enabling easy manufacturing through screen printing while ensuring high recognizability for automated inspection systems.
3Measurement precision
If the marker itself has a thickness, then the marker can be formed, but the thickness must be considered in designing the outer shape dimension
Solution Approach 1:
The marker layer thickness is controlled by adjusting the slurry application parameters and sintering conditions, allowing the marker to be formed with minimal thickness. The non-conductive particles are embedded within the magnetic layer depth, creating a marker that is visually distinct but dimensionally negligible, thereby eliminating the need to account for marker thickness in outer shape design.
4Measurement precision
If non-conductive particles are used in the marker layer, then the marker has excellent identifiability, but the particles need to be precisely controlled in size and distribution
Solution Approach 1:
The non-conductive particles are selected with specific size ranges (0.1-10 μm) and are dispersed in the slurry with appropriate viscosity control. During screen printing and sintering, these parameters are optimized to ensure uniform distribution of particles throughout the marker layer, achieving excellent identifiability while maintaining manufacturability through standard ceramic processing techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides excellent identifiability and simplifies manufacturing by ensuring the marker area has no thickness, facilitating automatic inspection and reducing complexity in assembly.
Implementation Method 1
obtaining a molded body having a marker area formed with the non-conductive particles in the marker layer being pressed into the first composite magnetic layer by compression molding of the multilayer body
Data Source
AI summary
A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.