Magnetic Component Heat Dissipation Pins and Circuit Board Channels
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Magnetic components in power electronics experience excessive temperature rise due to electrical power loss and hysteresis effects, leading to insulation melting and reduced magnetic permeability, which can cause short circuits and performance degradation.
Innovation Solution
A heat dissipation structure for magnetic components, comprising heat dissipation pins, heat conduction portions, a heat conduction layer, and a heat dissipation layer, which are integrated with a circuit board to effectively dissipate heat through heat channels, conduction portions, and dissipation layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If magnetic component operates at high current, then power output increases, but temperature rises excessively causing insulation melting and short circuit
Solution Approach 1:
The patent introduces heat dissipation pins as intermediary elements that physically connect the magnetic component to the circuit board's heat dissipation channels. These pins act as thermal mediators, transferring heat from the high-current component to the broader circuit board structure, enabling safe operation at higher power levels without insulation damage
Solution Approach 2:
The patent transitions heat dissipation from a two-dimensional surface contact to a three-dimensional conduction path by inserting heat dissipation pins vertically through the circuit board. This dimensional change creates direct thermal pathways from the component through the board to the opposite side, significantly improving heat removal capacity at high power levels
2Power
If magnetic component operates at high current, then power output increases, but hysteresis effect generates excessive heat reducing magnetic permeability and inductance
Solution Approach 1:
The heat dissipation pins serve as thermal intermediaries that continuously conduct heat away from the magnetic core during high-current operation. By maintaining the core temperature within acceptable ranges, the pins prevent hysteresis-induced temperature rise from degrading magnetic permeability and inductance, ensuring reliable performance at elevated power levels
Solution Approach 2:
The patent actively manages the temperature parameter of the magnetic core through thermal conduction pathways. By controlling the temperature parameter within the magnetic core's optimal operating range, the system maintains stable magnetic permeability and inductance values even during high-current operation where hysteresis effects are pronounced
3Temperature
If heat dissipation structure is added to magnetic component, then temperature control improves, but device complexity increases
Solution Approach 1:
The circuit board serves multiple functions: electrical connection, mechanical support, and heat dissipation pathway. By making the existing circuit board thermally conductive on its opposite side, the patent eliminates the need for separate heat sinks or cooling structures, maintaining simplicity while achieving effective temperature control
Solution Approach 2:
The patent merges the heat dissipation function with the existing circuit board structure by creating thermally conductive pathways through the board itself. This consolidation combines electrical and thermal management functions into a single structure, avoiding additional components and keeping the overall device complexity low
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat dissipation structure effectively reduces the temperature of magnetic components, enhancing reliability and performance by preventing overheating and maintaining inductance, while being simple and cost-effective.
Implementation Method 1
a circuit board provided with a plurality of heat dissipation channels, and the heat dissipation pins of the windings being in contact with the heat dissipation channels
Implementation Method 2
a plurality of heat conduction portions, disposed correspondingly under the heat dissipation channels and being in contact with a portion of the circuit board
Implementation Method 3
a heat conduction layer, laid under the heat conduction portions and being in contact with the heat conduction portions
Implementation Method 4
a heat dissipation layer, laid under the heat conduction layer and being in contact with the heat conduction layer
Data Source
AI summary
The present disclosure provides a heat dissipation structure for a magnetic component and a magnetic component having the same. The magnetic component includes a plurality of heat dissipation pins, which are disposed on the winding of the magnetic component, wherein the magnetic component has one or more windings. The heat dissipation structure includes a circuit board on which a plurality of heat dissipation channels are disposed, and the heat dissipation pins of the windings are in contact with the heat dissipation channels; a plurality of heat conduction portions are disposed correspondingly under the heat dissipation channels of the circuit board; a heat conduction layer is arranged under the heat conduction portions and contacts with the heat conduction portions; and a heat dissipation layer is arranged under the heat conduction layer and contacts with the heat conduction layer.