Injection-Molded Magnetic Component for Heat Dissipation and Fixation
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Solution Overview
Problem
Magnetic components in electronic devices face issues with poor thermal conductivity due to manual attachment of thermal pads, gaps between components, and shape limitations, leading to inefficient heat dissipation and increased manufacturing time and costs.
Innovation Solution
The integration of an insulating and thermal-conducting element that encapsulates or couples with the magnetic core and winding, forming a thermal bus path for heat transfer, and serving as a base, enhancing thermal conductivity and fixation strength while reducing volume and manufacturing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual attachment method is used to attach thermal pad to magnetic component, then the thermal pad can be attached to the component surface, but the production time is long and manufacturing precision is poor
Solution Approach 1:
The patent replaces the manual mechanical attachment process with an automated injection molding process. The insulating and thermal-conducting element is directly molded onto the magnetic component surface, eliminating manual thermal pad attachment operations. This substitution of mechanical manual work with automated molding technology simultaneously improves attachment precision and reduces production time.
Solution Approach 2:
The patent changes the physical state and properties of the insulating material by using injection molding parameters (temperature, pressure, time) to transform the material from a raw state to a precisely shaped attached element. This parameter control enables automated high-precision attachment without manual intervention, resolving the contradiction between precision and production time.
2Reliability
If manual attachment method is used to attach thermal pad to heat sink, then the thermal pad can be attached to the heat sink, but gaps are easily formed between the thermal pad and heat sink resulting in poor thermal conductivity
Solution Approach 1:
The patent replaces manual attachment operations with automated injection molding, ensuring consistent and precise attachment of the insulating and thermal-conducting element to both the magnetic component and heat sink. This eliminates the gaps that occur with manual attachment, improving thermal conductivity reliability through precise automated molding processes.
Solution Approach 2:
The patent uses composite insulating and thermal-conducting materials that combine both insulation and heat conduction properties. This composite material approach allows the element to maintain intimate contact with surfaces (improving thermal conductivity) while providing electrical insulation, and the automated molding ensures precise attachment without gaps.
3Strength
If conventional adhesive dispensing method is used to assemble magnetic core and base, then the components can be fixed together, but gaps are easily formed resulting in poor thermal conductivity
Solution Approach 1:
The patent replaces the adhesive dispensing process with injection molding, where molten insulating material is injected to fill and bond the magnetic core to the base. This automated molding process eliminates gaps that occur with adhesive methods, providing both strong fixation and reliable thermal conductivity through complete material filling and bonding.
Solution Approach 2:
The patent extracts and eliminates the adhesive layer from the assembly process, replacing it with a direct injection-molded insulating and thermal-conducting element that provides both mechanical bonding and thermal conduction in a single integrated component, removing the source of gap formation.
4Strength
If epoxy potting method is used to assemble magnetic component, then the components can be fixed together, but dimensional accuracy is difficult to control
Solution Approach 1:
The patent replaces manual epoxy potting with automated injection molding. The injection molding process provides precise control over material injection parameters (pressure, temperature, time), enabling accurate dimensional control of the insulating and thermal-conducting element while maintaining strong fixation, eliminating the dimensional errors associated with manual potting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation efficiency, increases fixation strength, reduces volume and manufacturing time, and achieves waterproof and dustproof effects, with improved dimensional accuracy and reduced costs.
Implementation Method 1
The insulating and thermal-conducting element is served as a thermal bus path for transferring the heat generated by the magnetic core and/or the winding
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
The present invention provides a magnetic component (1a, 1b, 2, 3, 4, 5). The magnetic component (1a, 1b, 2, 3, 4, 5) includes a magnetic core (11, 21, 31, 41), at least one winding (12, 22, 32, 42, 52) and at least one insulating and thermal-conducting element (13, 23, 33). The at least one winding (12, 22, 32, 42, 52) is wound around the magnetic core (11, 21, 31, 41). The at least one insulating and thermal-conducting element (13, 23, 33) is configured to at least partially encapsulate or be attached and coupled to at least one of the magnetic core (11, 21, 31, 41) and the winding (12, 22, 32, 42, 52). The insulating and thermal-conducting element (13, 23, 33) is served as a thermal bus path for transferring the heat generated by the magnetic core (11, 21, 31, 41) and/or the winding (12, 22, 32, 42, 52).