Magnetic Connection Members for Semiconductor Package Warpage Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor packages experience warpage due to thermal expansion coefficient differences between semiconductor chips, epoxy molding compounds, and package substrates, leading to interconnection failures and reduced reliability.
Innovation Solution
Incorporating magnetic connection members with opposite polar orientations between the semiconductor chip and the wiring substrate, which are designed to counteract warpage by using ferromagnetic or permanent magnetic materials, reducing structural instability and enhancing stability through physical contact and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional connection members are used between the semiconductor chip and wiring substrate, then the package structure is simple and easy to manufacture, but warpage occurs due to thermal expansion coefficient differences, leading to interconnection failure and reduced reliability
Solution Approach 1:
The connection member uses a composite structure consisting of a magnetic material layer (ferromagnetic or permanent magnetic material) combined with a non-magnetic conductive material layer. This composite structure provides both mechanical support and magnetic attraction force to counteract warpage caused by thermal expansion differences between the semiconductor chip, epoxy molding compound, and package substrate.
Solution Approach 2:
The invention changes the physical properties of the connection member by incorporating magnetic materials with specific magnetic strength and coercivity parameters. The magnetic material layer generates attractive force to counteract warpage, while the non-magnetic conductive layer ensures electrical connectivity. This parameter change allows the connection member to simultaneously provide mechanical stability and electrical function.
2Stability of the object's composition
If magnetic connection members are incorporated to counteract warpage, then structural stability and reliability are improved, but the manufacturing process becomes more complex
Solution Approach 1:
The connection member is segmented into distinct functional layers: a magnetic material layer for generating attractive force and a non-magnetic conductive material layer for electrical connectivity. This segmentation allows each layer to be optimized for its specific function while simplifying the manufacturing process, as each layer can be deposited or applied using standard thin-film fabrication techniques.
Solution Approach 2:
The connection member is designed to perform multiple functions simultaneously: providing mechanical support, generating magnetic attraction force to counteract warpage, and ensuring electrical connectivity between the semiconductor chip and wiring substrate. This multi-functionality reduces the need for separate components, thereby simplifying the overall manufacturing process despite the advanced material requirements.
3Reliability
If magnetic materials with opposite polar orientations are used in contact members, then warpage is reduced and package integrity is maintained, but the device complexity increases
Solution Approach 1:
The magnetic connection member incorporates magnetic materials with opposite polar orientations at different locations (first and second contact members having opposite polarities). This local differentiation of magnetic properties creates a magnetic attraction force that counteracts warpage. The opposite polar orientations are strategically placed to maximize the counteracting effect while maintaining a relatively simple overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The magnetic connection members effectively reduce warpage, increase the reliability and yield of semiconductor packages by providing structural stability and maintaining package integrity during the soldering process.
Implementation Method 1
The one or more magnetic material of the first contact members have an opposite polar orientation to that of the second contact members
Implementation Method 2
designed to counteract warpage by using ferromagnetic or permanent magnetic materials
Data Source
AI summary
Provided is a semiconductor package including a wiring substrate having top and bottom surfaces. A first semiconductor chip is disposed on the wiring substrate in a flip-chip manner. The first semiconductor chip has a first surface facing the top surface of the wiring substrate and a second surface opposite to the first surface. First connection members are disposed between the wiring substrate and the first semiconductor chip. The first connection members include first and second contact members each including one or more magnetic materials. The first contact members include portions disposed in the second contact members. The one or more magnetic material of the first contact members have an opposite polar orientation to that of the second contact members.