Magnetic Component Contact Alignment for Reflow Solder Coplanarity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for aligning contact surfaces of electrical and electronic components, particularly in reflow soldering processes, face challenges in achieving precise coplanarity, which is essential for effective soldering, often resulting in suboptimal alignment and attachment to conductor substrates.
Innovation Solution
A method involving a holding part that aligns contact surfaces by pressing the component against a baseplate with coplanar bearing surfaces, where the holding part can be heated to allow movement and repositioning of contacting elements, and subsequently solidified to fix the alignment, ensuring precise coplanarity and secure attachment through reflow soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If contact surfaces are mechanically aligned using conventional methods, then alignment is achieved, but coplanarity tolerance is insufficient (greater than 100 μm)
Solution Approach 1:
The patent replaces conventional mechanical alignment methods with a pressing mechanism that uses coplanar bearing surfaces on a baseplate. The contact surfaces are pressed against these bearing surfaces to achieve precise coplanarity (≤100 μm tolerance) without complex mechanical adjustment mechanisms, thus substituting a complex mechanical alignment system with a simpler pressing operation guided by precision bearing surfaces.
Solution Approach 2:
The patent changes the physical state of the holding part by heating it to a temperature where it becomes soft and deformable. This allows the holding part to be pressed and shaped during the alignment process, enabling the contact surfaces to conform to the coplanar bearing surfaces. After cooling, the holding part solidifies and maintains the aligned position, achieving precise coplanarity through temperature-induced parameter change.
2Ease of operation
If the holding part is heated to allow repositioning, then alignment flexibility is improved, but process time and energy consumption increase
Solution Approach 1:
The patent utilizes the phase transition of the holding part material from solid to soft/deformable state through heating, and back to solid state through cooling. This phase transition enables temporary flexibility during alignment, allowing the holding part to be easily deformed and repositioned. After alignment is achieved, the reverse phase transition locks the position, providing both operational flexibility and final stability.
3Manufacturing precision
If contact surfaces are pressed against coplanar bearing surfaces, then coplanarity is improved, but force and pressure requirements increase
Solution Approach 1:
The patent changes the temperature parameter of the holding part to make it soft and deformable during pressing. This reduces the pressure required to achieve coplanarity because the soft holding part can conform to the bearing surfaces without requiring high forcing, unlike rigid materials that would need significant pressure to deform and achieve the same alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves low-tolerance alignment and secure attachment of contact surfaces to conductor substrates, facilitating efficient application and contact during reflow soldering processes, thereby improving the reliability and precision of electrical and electronic component assembly.
Implementation Method 1
the holding part is heated so that the first contacting element with the first contact surface is movable relative to the second contact surface of the electrical and/or electronic component, wherein the holding part is formed in particular of plastic
Data Source
AI summary
A method for aligning contact surfaces (11, 21) of an electrical and/or electronic component (1), in particular of a magnetic component, is proposed. The method comprises a step (100) for providing the electrical and/or electronic component (1), wherein the electrical and/or electronic component (1) comprises at least one electrically conductive first contacting element (10) for electrically contacting the electrical and/or electronic component (1) with a conductor substrate,wherein a planar first contact surface (11) is formed on the first contacting element (10), wherein a planar second contact surface (21) is furthermore formed on the electrical and/or electronic component (1), wherein the first contacting element (10) is held by a holding part (4) on the electrical and/or electronic component (1), a step (300) for aligning the contact surfaces (11, 21), wherein the electrical and/or electronic component (1) is pressed against a baseplate (50) having a first bearing surface (51) and a second bearing surface (52), wherein the first contact surface (11) is pressed against the first bearing surface (51) of the baseplate (50) and the second contact surface (21) is pressed against a second bearing surface (52) on the baseplate (50) and the first contact surface (11) and the second contact surface (12) are aligned relative to one another.