Magnetic Contact Structure for Fine-Pattern Wafer Deposition
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Solution Overview
Problem
The reduced contact force between wafers and patterned masks due to thinner thickness and finer patterns in conventional deposition processes leads to a high failure rate in the deposition process.
Innovation Solution
A deposition device with a contact structure that includes a seating plate, magnet, and driving modules to enhance the contact force between the wafer and mask, along with a transfer device for automated wafer loading and unloading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the mask thickness is reduced and patterns are made finer to increase OLED panel resolution, then the manufacturing precision and resolution are improved, but the contact force between wafer and mask is reduced leading to higher deposition failure rate
Solution Approach 1:
The system performs preliminary actions by applying contact force to the mask before the deposition process begins. The driving module moves the seating plate in the first direction to bring the wafer into contact with the mask, ensuring proper contact is established before material deposition occurs. This preliminary contact establishment prevents deposition failures due to insufficient contact force.
Solution Approach 2:
The seating plate acts as an intermediary between the wafer and the mask. It provides a controlled interface that transmits contact force uniformly across the mask surface. The driving module moves the seating plate to regulate the contact force between wafer and mask, ensuring reliable contact even when mask thickness is reduced for higher resolution patterns.
2Device complexity
If conventional deposition process is used with thinner masks, then the process simplicity is maintained, but the contact force is insufficient causing high failure rate
Solution Approach 1:
The system incorporates self-service functionality through the driving module that automatically adjusts the contact force between wafer and mask during the deposition process. The control module autonomously controls the driving module to move the seating plate, ensuring optimal contact force is maintained without requiring external intervention or complex manual adjustments.
Solution Approach 2:
The system introduces dynamic control of the contact force between wafer and mask. The driving module can move the seating plate in the first direction to increase contact force, and the control module dynamically adjusts this force based on process requirements. This dynamic adjustment capability ensures reliable contact for thin masks while maintaining process adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced contact force between the wafer and mask reduces the failure rate in the deposition process, ensuring uniform deposition quality, particularly for micro patterns.
Implementation Method 1
a magnet coupled to the underside of the seating plate
Data Source
AI summary
The present inventive concept relates to a deposition system including: a deposition device having a chamber, a seating plate located inside the chamber to seat a wafer, a magnet coupled to the underside of the seating plate, and a mask assembly located inside the chamber; and a transfer device having a load lock chamber for accommodating the wafer, an arm member for transferring the wafer from the load lock chamber to the seating plate, and a fourth driving module for moving the arm member, wherein the deposition device includes a first driving module for moving the magnet and the seating plate, a second driving module coupled to the first driving module to move the magnet, a third driving module for moving the wafer, and a control module for controlling the first driving module, the second driving module, the third driving module, and the fourth driving module.