Magnetic Core Heat Dissipation Teeth for Compact Power Modules

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Solution Overview

Problem

Existing heat dissipation methods for magnetic power components like transformers and inductors face challenges with high material costs, risk of detachment in harsh environments, and process difficulties due to thermal expansion and dimensional tolerances, while traditional thermal pads and heat sinks are costly and difficult to apply effectively.

Innovation Solution

A magnetic power component design featuring a magnetic core with protruding heat dissipation teeth and a bonded structure to a printed circuit board, eliminating the need for additional heat sinks or thermal pads, enhancing heat dissipation through direct contact and airflow alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat sink is adhered to the magnetic core using thermal conductive adhesive, then heat dissipation capability is improved, but material costs increase and reliability decreases in harsh environments

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidattachment stability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent integrates the heat dissipation function directly into the magnetic core structure by adding heat dissipation teeth to the core body. This merging of functions eliminates the need for separate heat sink components and adhesive materials, thereby improving reliability while maintaining heat dissipation capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the heat dissipation function from the magnetic core and implements it through integrated teeth structures. This extraction eliminates the need for external heat sinks and thermal adhesives, solving the reliability issue of adhesive detachment in harsh environments.

Inventive Principle:
Principle #2Taking out (Extraction)

2Temperature

If a heat sink is adhered to the magnetic core, then heat dissipation capability is improved, but the structure becomes more complex and volume increases

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidstructural complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heat dissipation function is merged into the magnetic core itself through integrated teeth structures. This eliminates separate heat sink components and reduces overall structural complexity while maintaining effective heat dissipation capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent adds heat dissipation teeth to the outer surface of the magnetic core, utilizing the surface dimension for heat dissipation. This dimensional approach increases heat dissipation area without adding significant volume or structural complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Temperature

If thermal conductive adhesive is used to adhere the heat sink, then heat conduction capability is improved, but process difficulty increases due to material selection and cracking risks

Engineering Contradiction:
Improveheat conduction capabilityVSAvoidprocess difficulty
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent removes the thermal conductive adhesive from the system entirely by integrating heat dissipation teeth directly onto the magnetic core. This eliminates the complex material selection and application processes associated with adhesives while maintaining effective heat conduction.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The heat conduction path is merged into the magnetic core structure itself through the teeth. This integration eliminates the need for separate adhesive materials and simplifies the manufacturing process while maintaining effective thermal conduction from the core to the surrounding environment.

Inventive Principle:
Principle #5Merging (Combining)

4Temperature

If a thermal pad is disposed between the magnetic core and housing, then heat dissipation is improved, but material costs increase and applicable scenarios are limited

Engineering Contradiction:
Improveheat dissipationVSAvoidapplicable scenario
Core Design Contradiction:
TemperatureVSAdaptability or versatility

Solution Approach 1:

The heat dissipation function is merged into the magnetic core through integrated teeth, eliminating the need for external thermal pads. This integration makes the solution adaptable to various scenarios including cases where the magnetic core is far from the housing, as the heat dissipation occurs at the core itself.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves heat dissipation efficiency, reduces material costs, ensures stable attachment, and facilitates miniaturization by integrating heat dissipation directly into the magnetic core without additional components, while maintaining effective thermal conductivity.

Implementation Method 1

the magnetic core body is bonded to the printed circuit board, and the plurality of heat dissipation teeth are protruded from at least one outer surface that is of the magnetic core body and that faces away from the printed circuit board... heat of the printed circuit board can be conducted to the magnetic core, and the heat is dissipated by using the magnetic core

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12482590B2Magnetic power component and power module to which magnetic power component is applied
Publication Date: 2025.11.25 HUAWEI TECH CO LTD
  • US12482590B2 patent drawing
  • US12482590B2 patent drawing
  • US12482590B2 patent drawing

AI summary

A magnetic power component includes a printed circuit board and a magnetic core assembled to the printed circuit board. The magnetic core includes a magnetic core body and a plurality of heat dissipation teeth. The magnetic core body is bonded to the printed circuit board. The plurality of heat dissipation teeth is protruded from an outer surface that is of the magnetic core body and that faces away from the printed circuit board. The plurality of heat dissipation teeth and the magnetic core body are bonded through direct contact.