Magnetic Core Fill Ratio Gradient for Inductor Size Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing inductance components face challenges in size reduction and frequency increase due to reduced effective magnetic permeability and plating elongation issues when using magnetic materials with higher fill ratios or smaller grain sizes.
Innovation Solution
An electronic component with a core comprising a shaft and flange made of metal magnetic material, where the shaft is more densely filled with metal magnetic material than the flange, and the metal magnetic material is an aggregate of alloy magnetic grains with oxide films for inter-bonding, supporting high magnetic permeability and preventing plating elongation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the coil component is reduced, then the component achieves compactness and smaller dimensions, but the thickness of the magnetic body covering the coil is reduced causing effective magnetic permeability to drop
Solution Approach 1:
The patent applies local quality by creating a non-uniform fill ratio distribution within the magnetic body. The first region (core area) has a higher fill ratio of metal magnetic material to maintain high magnetic permeability, while the second region (outer area) has a lower fill ratio to prevent plating elongation. This spatial differentiation allows the component to achieve compact size while maintaining reliable magnetic properties in critical areas.
2Reliability
If a magnetic material with higher fill ratio is used to maintain magnetic permeability, then magnetic permeability is improved, but plating elongation occurs on the terminal electrode
Solution Approach 1:
The patent resolves this contradiction by applying local quality through regional differentiation of fill ratios. The first region containing the coil has high fill ratio for maintaining magnetic permeability, while the second region where the terminal electrode is formed has low fill ratio to prevent plating elongation. This allows both magnetic performance and plating quality to be optimized in their respective locations.
3Speed
If the grain size of magnetic material is reduced to support higher frequency range, then frequency capability is improved, but magnetic permeability of the material is reduced
Solution Approach 1:
The patent applies parameter changes by controlling the fill ratio of metal magnetic material in different regions. By adjusting the fill ratio parameter spatially, the patent compensates for the reduced magnetic permeability that results from using smaller grain size materials needed for high frequency operation. The higher fill ratio in the first region compensates for the inherent lower permeability of fine-grained materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact electronic component with high magnetic permeability, preventing plating elongation and allowing for size reduction and frequency increase, while maintaining strong electrodes and mechanical strength.
Implementation Method 1
adjacent alloy magnetic grains are aggregated with each another primarily by means of inter-bonding of oxide films formed near the surfaces of the grains
Data Source
AI summary
An electronic component has a shaft, a flange formed at an end of the shaft and constituting a core together with the shaft, a coiled conductor wound around the shaft, and an electrode terminal formed on the flange and connected electrically to an end of the conductor; wherein the shaft and flange are made of metal magnetic grains containing Fe which are bonded to each other by bonding of oxide film formed on each metal magnetic grain, and the shaft is more densely filled with the metal magnetic material than is the flange. The electronic component can achieve size reduction and frequency increase by improving the magnetic permeability while also improving the plating property for the terminal electrode.