Magnetic Core Inductive Element in IC Package
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Solution Overview
Problem
Existing integrated circuit packages for wireless communication devices face challenges in efficiently managing power consumption and size reduction due to the large inductance requirements of inductors in switched-mode power supplies, especially at high switching frequencies for RF signal transmission.
Innovation Solution
An integrated circuit package is developed with an inductive element that includes a magnetic core, where the inductive element is formed by conductive traces and pillars, and a redistribution layer, allowing for reduced inductance and size integration of inductors within the IC package, enabling improved power conversion efficiency and cost reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional inductors are used in switched-mode power supplies for RF transceivers, then power conversion efficiency can be maintained, but the inductor size becomes excessively large and cannot be integrated within the IC package
Solution Approach 1:
The patent embeds a magnetic core structure within the IC package, specifically positioning it beneath the semiconductor die and conductive elements. The magnetic core is nested within the package substrate, allowing the inductive element to achieve high inductance values in a compact form factor that fits within the IC package volume constraints.
Solution Approach 2:
The patent employs a composite structure combining conductive elements (traces and pillars) with a magnetic core material. This composite inductive element integrates different material properties - the conductive path provides electrical connectivity while the magnetic core enhances the magnetic flux density, achieving high inductance in a small volume suitable for IC package integration.
2Volume of moving object
If inductors are integrated within the IC package to reduce size, then package volume is reduced, but achieving sufficient inductance becomes difficult without compromising power conversion efficiency
Solution Approach 1:
The patent employs a composite structure combining conductive elements (traces and pillars) with a magnetic core material. This composite inductive element integrates different material properties - the conductive path provides electrical connectivity while the magnetic core enhances the magnetic flux density, achieving high inductance in a small volume suitable for IC package integration.
Solution Approach 2:
The patent modifies the magnetic properties of the core material and the geometric parameters of the conductive elements (trace width, pillar dimensions, spacing) to optimize the inductance value. By adjusting these parameters, the design achieves sufficient inductance values within the constrained package volume while maintaining power conversion efficiency.
3Quantity of substance
If the inductor is implemented as a separate component, then sufficient inductance can be achieved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the inductor function with existing IC package components by utilizing the semiconductor die, redistribution layer, and conductive pillars as part of the inductive element. This integration eliminates the need for separate inductor components and reduces assembly steps, thereby simplifying the overall device structure and manufacturing process while achieving the required inductance values.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of a magnetic core in the inductive element within the IC package reduces inductance, enabling efficient power conversion, size reduction, and cost savings by allowing the inductor to be integrated within the package, facilitating efficient power supply for RF transceivers.
Implementation Method 1
A magnetic core is disposed in the inductive element
Implementation Method 2
The semiconductor die includes a metal layer having first conductive traces and conductive pillars coupled to and extending from the metal layer
Data Source
AI summary
Aspects of the present disclosure provide an integrated circuit package having an inductive element with a magnetic core. An example integrated circuit package generally includes a semiconductor die, a redistribution layer, and a magnetic core. The semiconductor die includes a metal layer having first conductive traces and conductive pillars coupled to and extending from the metal layer. The redistribution layer is disposed below the semiconductor die and includes second conductive traces. A portion of the first conductive traces, a portion of the conductive pillars, and a portion of the second conductive traces are arranged to form an inductive element disposed below a portion of the semiconductor die. The magnetic core is disposed in the inductive element.