Magnetic Core Layer Profiling for Accurate On-Chip Inductance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods struggle to accurately measure the uneven profiles of magnetic material plates in inductive structures within semiconductor circuits, which are crucial for estimating inductance and ensuring precise manufacturing of inductive components.
Innovation Solution
A method is developed to measure the thickness profile and contour of magnetic material plates using optical interferometry and atomic force microscopy, enabling precise estimation of inductance and allowing for modified thicknesses and profiles in inductive structures during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If existing measurement methods are used, then measurement process is simple, but measurement precision of magnetic core layer profile is insufficient
Solution Approach 1:
The patent introduces an intermediary layer (such as a sacrificial layer or marker layer) between the magnetic core layer and the underlying structure. This intermediary layer serves as a reference for optical interferometry measurements, enabling precise determination of the magnetic core layer profile without directly measuring the magnetic material itself, thus resolving the contradiction between measurement precision and device complexity
Solution Approach 2:
The patent replaces traditional mechanical measurement methods (such as cross-sectional physical metrology) with optical interferometry. This substitution eliminates the need for complex mechanical sectioning and direct physical contact measurement, achieving high-precision magnetic core layer profile measurement through non-contact optical techniques while managing system complexity
2Reliability
If magnetic material plate thickness is increased, then inductance increases, but manufacturing precision becomes more difficult to control
Solution Approach 1:
The patent performs preliminary measurement of the magnetic material plate thickness and profile using optical interferometry before final assembly. This allows for early detection and correction of thickness variations, enabling inductance optimization while maintaining manufacturing precision through feedback control
Solution Approach 2:
The patent utilizes optical interferometry to precisely measure and control the thickness parameter of the magnetic material plate. By monitoring and adjusting the thickness parameter during manufacturing, the system achieves both desired inductance values and manufacturing precision through parameter optimization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise estimation of inductance in inductive structures, facilitating quality control and targeted inductance adjustment in semiconductor dies, particularly in voltage regulator circuits.
Implementation Method 1
A height profile of the magnetic material plate top surface may be generated by optical interferometry
Implementation Method 2
A height profile of the magnetic material plate top surface may be generated by atomic force microscopy
Data Source
AI summary
An inductive structure may be manufactured with in-situ characterization of dimensions by forming a metal line on a top surface of a semiconductor die, forming a passivation dielectric layer over the metal line, measuring a height profile of a top surface of the passivation dielectric layer as a function of a lateral displacement, forming a magnetic material plate over the passivation dielectric layer, measuring a height profile of a top surface of the magnetic material plate as a function of the lateral displacement, and determining a thickness profile of the magnetic material plate by subtracting the height profile of the top surface of the passivation dielectric layer from the height profile of the top surface of the magnetic material plate. An inductive structure including the magnetic material plate and the metal line is formed.