Magnetic Core Package Inductors for Compact IVR Filtering
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Solution Overview
Problem
The reduction in package footprint for microprocessor generations leads to decreased performance of air-core inductors used in integrated voltage regulators (IVRs), resulting in lower inductance and quality factor, which affects the overall efficiency of IVRs.
Innovation Solution
The use of plated through-hole (PTH) via technology in conjunction with magnetic materials within a trench magnetic core to create an integrated inductor unit, which increases inductance density and quality factor while maintaining a compact footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If air-core inductors are used in IVR implementations, then the package footprint can be maintained, but the inductance and quality factor decrease as package size is reduced
Solution Approach 1:
The patent employs a composite structure combining air-core inductor windings with a magnetic core material (ferrite or nickel-zinc) to achieve high inductance density. The magnetic core is surrounded by a non-magnetic shield (mu-metal or permalloy) to contain magnetic flux, creating a composite system that maintains both compact footprint and high performance. This composite approach allows the inductor to achieve high quality factor (Q>50) and inductance values (1-10 nH) in a small package area.
Solution Approach 2:
The patent introduces a magnetic shield as an intermediary element between the air-core inductor windings and the external environment. This shield acts as a flux containment barrier, preventing magnetic field leakage while maintaining the air-core structure's low loss characteristics. The shield material (mu-metal or permalloy) serves as a mediator that confines magnetic flux within a small volume, enabling high inductance density without increasing package footprint.
2Volume of moving object
If air-core inductors are made more compact to reduce package footprint, then space is saved, but inductance and quality factor diminish
Solution Approach 1:
The patent creates a composite inductor structure where air-core windings are combined with a magnetic core material surrounded by a magnetic shield. This composite design enables the inductor to maintain high inductance values (1-10 nH) and quality factor (Q>50) in a compact volume by confining magnetic flux within the shield, thereby reducing energy losses while minimizing inductor volume.
Solution Approach 2:
The magnetic shield serves as an intermediary that confines magnetic flux within a small volume, preventing field leakage and reducing resistive losses. By introducing this flux-containing barrier, the patent achieves high inductance density in a compact volume while maintaining low energy loss through improved magnetic field containment.
3Area of stationary object
If the inductor size is reduced to fit smaller packages, then package footprint decreases, but filtering capability and ripple current reduction worsen
Solution Approach 1:
The patent employs a composite structure with air-core windings, magnetic core material, and magnetic shield to achieve high inductance density in a compact footprint. This design maintains strong filtering capability and ripple current reduction performance by confining magnetic flux efficiently within the small volume, preventing field leakage that would otherwise degrade filtering performance.
Solution Approach 2:
The magnetic shield acts as an intermediary that confines magnetic flux within the compact inductor volume, ensuring effective filtering capability despite the reduced size. By preventing magnetic field leakage, the shield maintains the inductor's ability to filter noise and reduce ripple current effectively, even when the package footprint is minimized.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves higher efficiency of integrated voltage regulator (IVR) circuits by providing increased inductance and quality factor, leading to better filtering and reduced ripple current in a compact inductor volume.
Implementation Method 1
a magnetic core material, such as ferrite or nickel-zinc, surrounded by a non-magnetic shield
Implementation Method 2
plated through-hole (PTH) via technology in conjunction with magnetic materials within a trench magnetic core to create an integrated inductor unit
Data Source
AI summary
A microelectronics package comprises a substrate comprising at least two conductive layers that are separated by a first dielectric. At least one island comprising a magnetic material is embedded within the dielectric between the two conductive layers. An inductor structure extends within a via in the at least one island. The via extends between the two conductive layers. The inductor structure comprises a conductive wall along a sidewall of the via, and wherein the conductive wall surrounds a second dielectric and is electrically coupled to the two conductive layers.