Magnetic Core Power Module Layout for Heat Dissipation and PCB Space
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Solution Overview
Problem
Conventional power modules face challenges in effectively dissipating heat due to increased thermal resistance, restricted installation space for output capacitors, and impaired reliability of ball grid arrays, which hinder the miniaturization and performance of electronic devices.
Innovation Solution
A power module design featuring a multi-layered structure with a magnetic core assembly and first circuit board assembly, incorporating balanced magnetic flux regions and conductors to reduce thermal resistance, enhance heat dissipation, and accommodate more output capacitors while maintaining mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the printed circuit board is used as the heat transfer path in conventional power modules, then the thermal resistance between heat sources and system board is reduced, but the installation space for output capacitors is restricted and heat dissipation efficiency is impaired
Solution Approach 1:
The patent introduces a magnetic core assembly with a multi-layered structure that adds a new dimension for heat transfer. The heat transfer path extends through the magnetic core assembly's first surface, second surface, and third surface, creating a three-dimensional heat dissipation architecture rather than relying solely on the two-dimensional printed circuit board path. This dimensional expansion provides additional space for output capacitor installation while maintaining effective heat transfer.
Solution Approach 2:
The patent segments the heat transfer function across multiple components and surfaces: the printed circuit board, the magnetic core assembly's first surface, second surface, and third surface. This segmentation allows heat to be distributed across multiple pathways and surfaces, increasing the total heat transfer area and providing more installation space for output capacitors without compromising heat dissipation efficiency.
2Volume of moving object
If the power module is miniaturized to reduce electronic device volume, then the layout space is reduced, but the thermal management and reliability of ball grid arrays are impaired
Solution Approach 1:
The patent employs a nested structure where the magnetic core assembly contains multiple functional elements including the heat transfer path, output capacitors, and ball grid arrays. The magnetic core assembly's multi-layered design allows these components to be nested within each other in a compact arrangement, reducing overall power module volume while maintaining proper spacing and thermal pathways for reliable operation.
3Speed
If output capacitors are relocated from the system board surface to the inner space of the power module, then the layout path is shortened and dynamic switching performance is enhanced, but the thermal conduction to the system board is blocked
Solution Approach 1:
The magnetic core assembly serves as an intermediary structure that facilitates both the relocated output capacitors and effective thermal conduction. The magnetic core assembly's multi-layered design with designated heat transfer surfaces acts as a mediator between the relocated capacitors and the heat dissipation system, allowing thermal energy to be conducted through the magnetic core assembly to the system board even though capacitors are no longer directly mounted on the board surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces thermal resistance, increases heat dissipation efficiency, and allows for more output capacitors, enhancing the power module's performance and reliability, thus meeting high-power density requirements.
Implementation Method 1
The thermal resistance between the heat sources (for example the copper bars 84, 85 or the switch elements) and the system board 9 is caused by the printed circuit board 83 of the power module 8 and is small. Consequently, the heat generated from the power module 8 can be transferred to the system board 9 to be dissipated away.
Data Source
AI summary
A power module comprises a first circuit board assembly and a magnetic core assembly. The first circuit board assembly comprises a first printed circuit board and at least two switch circuits disposed on the first printed circuit board. The magnetic core assembly is disposed near the first printed circuit board and comprises a magnetic core portion and at least a pair of first electrical conductors. The magnetic core portion comprises at least a core unit, the core unit comprises a pair of holes and a second magnetic overlapping region, and the pair of holes are separated by the second magnetic overlapping region. Each pair of the first electrical conductors is penetrated through the corresponding pair of holes of the magnetic core portion to define two output inductors. Each of the switch circuits is electrically connected with the corresponding output inductor to define a phase circuit of the power module.