Magnetic-Core Stacked Inductor in Polymer Substrates for Higher Q
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Solution Overview
Problem
Current inductors in electronic devices fail to meet stringent requirements for inductance and quality factor due to inadequate magnetic properties, particularly in high-density device packaging applications such as wireless charging and chip-to-chip communication.
Innovation Solution
A method of forming a magnetic core within a stacked inductor coil on a substrate by etching polymer layers to create features and depositing magnetic material within these features, enhancing the inductance and quality factor of the inductor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a polymer material with dielectric properties is used to create an inductor, then the inductor can be fabricated within the polymer material structure, but the inductance and quality factor do not satisfy current quality demands
Solution Approach 1:
The patent changes the material parameter by introducing magnetic material into the polymer structure. Specifically, magnetic material is deposited within etched features (vias) through the polymer layers, transforming the inductor from a simple polymer-based structure to a composite structure with enhanced magnetic properties, thereby improving inductance and quality factor
Solution Approach 2:
The patent creates a composite material structure by combining polymer layers with magnetic material. The magnetic material is embedded within the polymer matrix through etched features, forming a composite inductor that leverages both the dielectric properties of the polymer and the magnetic properties of the embedded material to achieve superior electrical performance
2Reliability
If multiple magnetic cores are deposited within etched features through polymer layers, then the magnetic field is amplified and inductance is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent segments the magnetic core into multiple discrete features distributed throughout the polymer layers. Instead of a single continuous magnetic core, separate magnetic material deposits are placed within individual etched features at different locations and depths, allowing independent optimization of each segment while collectively achieving the desired magnetic field amplification
Solution Approach 2:
The patent extends the magnetic core structure into the third dimension by etching features through multiple stacked polymer layers. Magnetic material is deposited within these through-layers, creating a three-dimensional distributed magnetic core structure that amplifies the magnetic field more effectively than planar configurations while maintaining compatibility with standard semiconductor fabrication processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach results in improved inductance and quality factor, enabling more effective wireless charging and chip-to-chip communication by amplifying the magnetic field with multiple magnetic cores, thus meeting advanced packaging demands.
Implementation Method 1
amplifying the magnetic field with multiple magnetic cores
Data Source
AI summary
A method of forming a magnetic core on a substrate having a stacked inductor coil includes etching a plurality of polymer layers to form at least one feature through the plurality of polymer layers, wherein the at least one feature is disposed within a central region of a stacked inductor coil formed on the substrate; and depositing a magnetic material within the at least one feature.