Magnetic Material Integration in Coreless Substrates via Barrier Layers

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Solution Overview

Problem

Current electronic packaging processes face challenges in integrating magnetic materials due to corrosion and leaching issues, which affect processing environments and require dedicated tools and capital expenditures, hindering efficient power delivery improvements without increasing package form factor.

Innovation Solution

Embedding magnetic materials within electronic packages using barrier layers to protect them from detrimental processing environments, allowing for their integration without altering existing processing chemistries and enabling quicker design times and reduced capital expenditures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If magnetic material is integrated into the package using current substrate manufacturing processes, then power delivery improvement is achieved, but the magnetic material corrodes and leaches into chemistry baths

Engineering Contradiction:

Improvepower deliveryVSAvoidmagnetic material integrity

Core Design Contradiction:

PowerVSReliability

Solution Approach 1:

A barrier layer is introduced as an intermediary between the magnetic material and the chemistry baths. This barrier layer prevents direct contact between the magnetic fillers and corrosive chemicals, eliminating corrosion and leaching while allowing the magnetic material to maintain its power delivery function.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention converts the harmful interaction between magnetic materials and chemistry baths into a beneficial situation by using the barrier layer to create a controlled environment. The barrier layer transforms the potentially damaging processing environment into a safe one, allowing magnetic materials to be successfully integrated without corrosion issues.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If magnetic material is formed last to avoid corrosion, then magnetic material integrity is maintained, but solder resist lamination requires dedicated tools and capital expenditure

Engineering Contradiction:

Improvemagnetic material integrityVSAvoidprocessing equipment requirements

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The barrier layer is formed in advance, before the magnetic material is deposited. This preliminary protective action allows subsequent processing steps, including solder resist lamination, to proceed using existing equipment without risk of magnetic material corrosion, eliminating the need for dedicated tools.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The barrier layer serves as a protective intermediary that enables standard processing equipment to handle magnetic material-containing substrates without modification. It mediates between the magnetic material and processing environments, allowing conventional tools to be used throughout the manufacturing process.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If magnetic material is formed last to avoid corrosion, then magnetic material integrity is maintained, but new product schedules are at risk

Engineering Contradiction:

Improvemagnetic material integrityVSAvoidproduct development schedule

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The barrier layer is prepared in advance, enabling magnetic material to be integrated at any point in the manufacturing process without requiring process resequencing. This eliminates schedule risks associated with forming magnetic material as the final step while maintaining material integrity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The barrier layer creates a universal processing platform that accommodates magnetic material integration without requiring dedicated tools or process modifications. This multi-functional approach allows existing manufacturing lines to produce magnetic-containing packages using standard equipment and workflows.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the integration of magnetic materials without exposing them to corrosive environments, reducing contamination risks and allowing for flexible solder resist layer formation before or after dummy core removal, thus enhancing power delivery capabilities without increasing package size.

Implementation Method 1

Embedding magnetic materials within electronic packages using barrier layers to protect them from detrimental processing environments

Methodology Applied

Scientific EffectPhysical barrier protection: Physical Containment

Data Source

PatentUS11735537B2Methods to embed magnetic material as first layer on coreless substrates and corresponding structures

Publication Date: 2023.08.22 INTEL CORP

AI summary

Embodiments include an electronic package that includes a first layer that comprises a dielectric material and a second layer over the first layer, where the second layer comprises a magnetic material. In an embodiment, a third layer is formed over the second layer, where the third layer comprises a dielectric material. In an embodiment, the third layer entirely covers a first surface of the second layer. In an embodiment a first conductive layer and a second conductive layer are embedded within the second layer. In an embodiment, sidewalls of the first conductive layer and the second conductive layer are substantially vertical.