Magnetic Coupling Alignment for Chip Module Connectors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional connector assemblies for high-frequency microwave chips fail to provide precise alignment for efficient signal transmission, especially for modern applications requiring smooth interfaces and gentle handling, which are not adequately addressed by existing protruding and recessed structure arrangements.
Innovation Solution
A coupling system with two mutually perpendicular interfaces, where one interface equipped with magnets enables precise alignment and efficient signal transmission, including a first connecting unit with a printed circuit board, chip modules, and an electrical connector with magnetic elements, and a second unit with a recessed structure, allowing intimate sliding contact for both electrical and optical signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional protruding and recessed connector structures are used, then mechanical connection and retention are achieved, but alignment precision and signal transmission efficiency deteriorate
Solution Approach 1:
The patent replaces traditional mechanical protruding-recessed alignment structures with a magnetic field-based alignment system. Magnets embedded in the connector housings create magnetic attraction forces that automatically align the connectors during mating, eliminating the need for precision-machined mechanical alignment features and achieving superior alignment precision through magnetic field interaction.
Solution Approach 2:
The patent changes the physical parameter of the connection interface from mechanical contact-based alignment to magnetic field-based alignment. By introducing magnetic fields as the alignment mechanism, the system achieves both precise alignment and gentle handling, resolving the contradiction between alignment precision and signal transmission efficiency.
2Ease of operation
If traditional heavy duty connector structures are used, then mechanical strength and retention are improved, but interface smoothness and gentleness deteriorate
Solution Approach 1:
The patent substitutes harsh mechanical engagement structures with a magnetic field-based connection system. The magnetic attraction provides both the necessary connection strength and a smooth, gentle interface, as the magnetic force acts uniformly across the connector surfaces without requiring rough mechanical features like protrusions or recesses.
Solution Approach 2:
The patent changes the operational parameter of the connector interface from mechanical interlocking to magnetic attraction. This parameter change enables the interface to be both smooth and gentle to the touch while maintaining adequate mechanical strength through magnetic holding force, resolving the contradiction between ease of operation and mechanical strength.
3Measurement precision
If magnets are added to the connector assembly, then alignment precision is improved, but device complexity increases
Solution Approach 1:
The patent merges the alignment function and the connection function into a single magnetic field-based system. The magnets serve dual purposes: providing alignment precision during mating and maintaining connection strength after mating, thereby improving alignment precision without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The magnetic coupling system ensures precise alignment and efficient signal transmission, reducing transmission loss and enabling high-speed data exchange between chip modules, suitable for both electrical and optical signals, while providing a smooth and gentle interface suitable for modern applications.
Implementation Method 1
The electrical connector is equipped with magnets for activating mating with a counterpart electrical connector
Data Source
AI summary
A coupling system includes a first connecting unit and a second connecting unit adapted to be connected to each other either directly or indirectly through an adaptor. Each of the first connecting unit and a second connecting unit includes an enclosure with a first mating surface and a second mating face perpendicular to each other, a pair of chip modules and an electrical connector. The electrical connector is exposed on the first mating surface while the chip module is protectively hidden behind the second mating surface. The electrical connector is equipped with magnets for activating mating with a counterpart electrical connector so as to have the chip modules of the first connecting unit and those of the second connecting unit aligned for coupling.


