Electrical Isolator Packaging Using Magnetic Coupling
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Solution Overview
Problem
Current electrical isolators face challenges in efficiently transmitting high frequency signals without signal distortion and high power consumption, particularly due to incompatibility with CMOS manufacturing processes and the need for additional modulation and demodulation when using transformers or capacitors.
Innovation Solution
The use of a magnetic coupling between a coil and a magnetic field (MF) sensor, integrated into a chip manufacturing process, eliminates the need for modulation and demodulation, reducing power consumption and signal distortion by directly transmitting control signals as magnetic field signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical couplers are used as electrical isolators, then signal transmission between different voltage domains is achieved, but manufacturing compatibility with CMOS process is poor and additional packaging is required
Solution Approach 1:
The patent replaces optical coupling mechanisms with magnetic field coupling. Instead of using LED and photodetector systems that require mechanical packaging, the invention uses a coil structure and magnetic field sensor that can be directly integrated into CMOS circuits, eliminating the need for additional packaging while maintaining electrical isolation functionality
Solution Approach 2:
The patent merges the electrical isolator function with standard CMOS manufacturing processes. By integrating the coil and magnetic field sensor directly into the chip fabrication process, the invention combines previously separate functions (isolation and signal transmission) into a unified structure that can be manufactured using existing CMOS technology
2Ease of manufacture
If transformers or capacitors are used as electrical isolators, then chip integration is achieved, but additional modulation and demodulation functions are required increasing device complexity
Solution Approach 1:
The patent extracts and eliminates the modulation and demodulation functions from the system. By using direct magnetic field coupling between the coil and magnetic field sensor, the invention removes the need for complex modulation/demodulation circuits that would otherwise be required when using transformers or capacitors, thereby reducing device complexity while maintaining chip integration
Solution Approach 2:
The patent introduces magnetic field coupling as an intermediary mechanism between the primary and secondary circuits. Instead of using electrical coupling through transformers or capacitors that require modulation, the invention uses magnetic field lines as an intermediary to transfer signals across the isolation barrier, simplifying the overall system architecture
3Reliability
If LED is used in optical couplers, then electrical isolation is achieved, but light decay and heat loss occur increasing energy consumption
Solution Approach 1:
The patent replaces the optical conversion process (electrical to optical to electrical) with direct magnetic field coupling. By eliminating LED and photodetector components, the invention removes the energy losses associated with light emission and detection, achieving electrical isolation through magnetic field interaction that is more energy-efficient
Solution Approach 2:
The patent converts the potentially harmful effect of magnetic fields (which can cause interference) into a beneficial coupling mechanism. By using magnetic field lines as the transmission medium, the invention transforms what could be a source of interference into an efficient energy transfer pathway that maintains electrical isolation while minimizing energy loss
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient transmission of both high and low frequency signals with reduced power consumption and signal distortion, enhancing the operating speed and stability of the circuit loop.
Implementation Method 1
the coil transmits a signal to the MF sensor through magnetic coupling
Data Source
AI summary
An electrical isolator packaging structure and a manufacturing method of an electrical isolator are provided. The electrical isolator packaging structure includes a first substrate, a second substrate, a coil, and a magnetic field (MF) sensor. The coil is disposed on the first substrate. The MF sensor is disposed on the second substrate. The position of the coil is arranged according to the position of the MF sensor such that the coil transmits a signal to the MF sensor. Thus, the electrical isolator can be implemented by magnetic coupling with the coil and the MF sensor.