Magnetic Detection of Back-Side Layer in Integrated Circuits

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing integrated circuits (ICs) used in smartcards and similar applications face complex security challenges due to back-side attacks, which are becoming increasingly significant, especially for bank cards, and require protection against physical attacks that aim to retrieve data from the ICs.

Innovation Solution

An integrated circuit design featuring a substrate with a magnetizable region on one side and magnetic field sensors on the other, utilizing deposition processing techniques to create a miniaturized solution that detects any attempt to remove or damage the magnetizable region, providing a simple and effective security mechanism.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If complex protection schemes with multiple layers and components are used to protect against back-side attacks, then security reliability is improved, but device complexity increases

Engineering Contradiction:
Improvesecurity reliabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention extracts the security function from complex multi-layer protection schemes and implements it through a single magnetizable layer on the back-side coupled with magnetic field sensors on the front-side. This isolation of the security mechanism to essential components reduces device complexity while maintaining security reliability against back-side attacks.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention replaces complex mechanical protection structures with a magnetic field-based detection system. Instead of using multiple physical barriers and mechanical security layers, the system uses magnetic field sensors to detect the presence and integrity of the magnetizable layer, substituting mechanical complexity with electromagnetic detection.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If miniaturization is achieved through deposition processing techniques, then ease of manufacture is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improveease of manufactureVSAvoidmanufacturing precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The invention uses deposition processing techniques to control the thickness and magnetic properties of the magnetizable layer through parameter optimization. By adjusting deposition parameters such as thickness, material composition, and magnetic anisotropy, the system achieves miniaturization while maintaining manufacturability through standard semiconductor fabrication processes.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design offers a robust security solution against external attacks by detecting any damage or removal of the magnetizable region, preventing unauthorized access and ensuring the integrity of the IC's contents, while being suitable for use in bank cards due to its reduced dimensions and simplified construction.

Implementation Method 1

a magnetizable region (50a) provided on the second side (S2) of the substrate (SUB) by using a deposition processing step, a magnetic moment of the magnetizable region (50a) being configurable for generating a magnetic field detectable at the location of the at least one magnetic field sensor

Methodology Applied
Scientific EffectMagnetic field generation: Magnetism

Implementation Method 2

an electronic circuit provided at the first side (S1) of the substrate (SUB), wherein the electronic circuit comprises at least one magnetic field sensor

Methodology Applied
Scientific EffectMagnetic field detection: Hall Effect

Data Source

PatentUS8657191B2Magnetic detection of back-side layer
Publication Date: 2014.02.25 NXP BV
  • US8657191B2 patent drawing
  • US8657191B2 patent drawing
  • US8657191B2 patent drawing

AI summary

The invention relates to an integrated circuit comprising a substrate having a first side and a second opposing side. An electronic circuit (EC) is provided at the first side (S1) of the substrate, wherein the electronic circuit (EC) comprises at least one magnetic field sensor (Snsr, Snsr1, Snsr2, Snsr3, Snsr4). The integrated circuit further comprises a magnetizable region (MR) provided on the second side (S1) of the substrate (SUB) by using a wafer-level type deposition processing step. The magnetic moment of the magnetizable region (MR) is configurable for generating a magnetic field (H1, H2) detectable at the location of the at least one magnetic field sensor (Snsr, Snsr1, Snsr2, Snsr3, Snsr4). The integrated circuit constitutes a very simple construction and enables a strongly miniaturized solution which is, because of its reduced dimensions well suitable for being used in bank cards. An attempt to remove the integrated circuit according to the invention from its environment (e.g. a bank card) may result in the magnetizable region (MR) getting damaged (partially removed) or even completely removed. The invention provides a first level of security against external attack. Embodiments of the invention provide higher security levels. Various magnetic field sensors are illustrated which may be advantageously integrated in the integrated circuit. The invention also relates to a card provided with such integrated circuit. The card in accordance with the invention is more secure. The invention further relates to a method of initializing such integrated circuit and a method of checking the authenticity of such integrated circuit.