Magnetic Element Stack With Adhesive Layer to Prevent Peeling
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Solution Overview
Problem
The semiconductor industry faces challenges in forming reliable semiconductor devices at smaller sizes due to increased complexity and difficulty in fabrication processes, particularly in maintaining adhesion and preventing peeling issues between material layers during the formation of magnetic elements.
Innovation Solution
A process involving the formation of an adhesive layer made of metal materials like titanium or copper alloys, a protective layer, and an etch stop layer, along with patterned mask layers and etching processes, is used to create a semiconductor device structure. This process includes forming an adhesive layer over a semiconductor substrate, depositing a protective layer and etch stop layer, sequentially depositing magnetic layers, and using patterned mask layers for precise etching to form magnetic elements while preventing peeling and hollow structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If feature sizes continue to decrease to increase functional density, then production efficiency increases and costs decrease, but fabrication process complexity increases and reliability decreases
Solution Approach 1:
An adhesive layer is formed prior to depositing magnetic layers to pre-establish strong bonding between the substrate and subsequent layers. This preliminary adhesion preparation prevents peeling and delamination that could occur during subsequent fabrication processes, thereby maintaining reliability even as feature sizes decrease.
Solution Approach 2:
The patent employs a composite structure consisting of multiple material layers including adhesive layer, magnetic layers, protective layers, and etch stop layers. Each layer is specifically engineered with appropriate material properties to address specific challenges, creating a composite system that maintains overall device reliability despite scaling to smaller dimensions.
2Length of moving object
If feature sizes continue to decrease, then geometric scaling benefits are achieved, but fabrication process difficulty increases
Solution Approach 1:
Different regions of the device structure are assigned different material properties and functions. The adhesive layer provides enhanced bonding in critical areas, while protective layers offer targeted protection during specific fabrication steps. This localized optimization allows precise control over each region, making the overall fabrication process more manageable despite small feature sizes.
Solution Approach 2:
The fabrication process is divided into distinct sequential steps with dedicated layers formed at each stage: adhesive layer formation, magnetic layer deposition, protective layer application, and etch stop layer formation. This segmentation of the manufacturing process into discrete, controlled operations reduces complexity and improves ease of manufacture compared to attempting to form all structures simultaneously.
3Reliability
If adhesive layer is formed to prevent peeling, then layer adhesion improves, but device structure complexity increases
Solution Approach 1:
The adhesive layer serves multiple functions simultaneously: it provides strong bonding between layers, acts as a stress buffer to prevent delamination, and serves as a foundation for subsequent layer deposition. By consolidating these functions into a single layer rather than requiring multiple separate structural elements, the overall device complexity is minimized while maintaining reliable adhesion.
Solution Approach 2:
The adhesive layer acts as an intermediary between the substrate and the magnetic layers, providing a bonding interface that reconciles the different material properties of adjacent layers. This intermediate layer facilitates strong adhesion without requiring direct bonding between incompatible materials, thereby preventing peeling while adding minimal structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process improves the quality and reliability of semiconductor devices by preventing peeling and hollow structures, ensuring proper adhesion and reducing stress-related damage, thereby enhancing the performance and efficiency of magnetic elements.
Implementation Method 1
an adhesive layer made of metal materials like titanium or copper alloys
Implementation Method 2
depositing a protective layer and etch stop layer
Implementation Method 3
using patterned mask layers for precise etching to form magnetic elements
Implementation Method 4
sequentially depositing magnetic layers
Data Source
AI summary
A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an adhesive element between the magnetic element and the substrate. The adhesive element extends exceeding opposite edges of the magnetic element. The semiconductor device structure further includes an isolation element extending exceeding the opposite edges of the magnetic element. The isolation element partially covers a top surface of the magnetic element. In addition, the semiconductor device structure includes a conductive line over the isolation element.