Semiconductor Package with Magnetic Encapsulation Inductor

Solution Overview

Problem

Semiconductor packages incorporating semiconductor chips and inductors become large and expensive due to the need for protective encapsulation, while manufacturers and consumers seek smaller, more cost-effective devices with increased functionality.

Innovation Solution

The use of a polymer-based encapsulation material containing magnetic particles, such as iron, nickel, or molybdenum, to form a magnetic winding core within the inductor, which is integrated into the semiconductor chip or externally attached, allowing for reduced package size and increased functionality through fan-out type packages and electric redistribution structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If semiconductor chips are encapsulated in mold compound and inductors are coupled and embedded, then reliability and performance are ensured, but package size increases and cost increases

Engineering Contradiction:

Improvechip protectionVSAvoidpackage size

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent combines the encapsulation body and inductor into a single integrated structure. The inductor is formed within the encapsulation material itself, eliminating the need for separate inductor components and reducing overall package size while maintaining protection functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The encapsulation material serves multiple functions: it protects the semiconductor chip from environmental impacts and simultaneously forms the magnetic winding core of the inductor. This multi-functionality reduces the number of separate components needed.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If semiconductor chips are encapsulated in mold compound and inductors are coupled and embedded, then reliability and performance are ensured, but manufacturing cost increases

Engineering Contradiction:

Improvechip protectionVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines the encapsulation body and inductor into a single integrated structure. The inductor is formed within the encapsulation material itself, eliminating the need for separate inductor components and reducing overall package size while maintaining protection functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent changes the material parameters of the encapsulation material by incorporating magnetic particles, transforming it from a simple protective coating into a functional inductor component. This eliminates the need for separate inductor manufacturing and assembly steps.

Inventive Principle:

Principle #35Parameter changes

3Adaptability or versatility

If inductors are embedded in packages with encapsulation material, then device functionality is achieved, but package complexity increases

Engineering Contradiction:

Improvedevice functionalityVSAvoidpackage structure

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The encapsulation material serves multiple functions: it protects the semiconductor chip from environmental impacts and simultaneously forms the magnetic winding core of the inductor. This multi-functionality reduces the number of separate components needed.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent uses composite encapsulation material containing magnetic particles (such as iron, nickel, or molybdenum) dispersed in a polymer matrix. This composite structure provides both protective and inductive functions within a single material system.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in smaller, more cost-effective semiconductor packages with enhanced inductance and relaxed constraints on package pad size and pitch, facilitating improved device performance and assembly efficiency.

Implementation Method 1

The use of a polymer-based encapsulation material containing magnetic particles, such as iron, nickel, or molybdenum, to form a magnetic winding core within the inductor

Methodology Applied

Scientific EffectMagnetism: Magnetism

Data Source

PatentUS8513771B2Semiconductor package with integrated inductor

Publication Date: 2013.08.20 INFINEON TECHNOLOGIES AG

AI summary

A semiconductor package includes a semiconductor chip. An inductor is applied to the semiconductor chip. The inductor has at least one winding. An encapsulation body is formed of an encapsulation material. The encapsulation material contains a magnetic component and fills a space within the winding to form a magnetic winding core.