Magnetic Encapsulation Module Structure for Compact Power Modules
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Solution Overview
Problem
Existing power module products face space utilization limitations due to installation tolerance issues with purchased inductors, especially in smaller modules, which restrict their ability to fully optimize available space.
Innovation Solution
The development of a module structure that incorporates an encapsulation body with magnetic properties for inductive elements and non-magnetic properties for non-inductive elements, allowing for partial or full encapsulation of inductive components and strategic placement of pins for improved heat dissipation and electrical connectivity, utilizing materials like epoxy resin, phenolic resin, and magnetic particles such as carbonyl iron powder.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If purchased inductors are used in traditional power modules, then electrical functionality is achieved, but space utilization is limited due to installation tolerance requirements
Solution Approach 1:
The patent merges the inductor component with the module substrate by directly forming inductive traces on the PCB layer, eliminating the need for separate purchased inductors. This integration removes installation tolerance requirements and maximizes space utilization, enabling smaller module dimensions while maintaining electrical functionality.
Solution Approach 2:
The PCB substrate serves multiple functions: it provides mechanical support, electrical connectivity through traces, and inductive functionality through specifically designed trace patterns. This multi-functionality eliminates the need for dedicated inductor components, resolving the space utilization vs. manufacturing precision contradiction.
2Ease of operation
If traditional module structures are used with separate inductors, then component functionality is maintained, but module dimensions increase reducing space efficiency
Solution Approach 1:
The patent combines multiple functions into integrated structures: the PCB traces serve both as electrical connectors and inductive elements, while the encapsulation body simultaneously protects components and provides heat dissipation pathways. This integration reduces module volume while maintaining or improving heat dissipation performance through optimized thermal paths.
Solution Approach 2:
The patent utilizes three-dimensional trace routing and layered PCB structures to achieve inductive functionality within the planar substrate area, rather than adding vertical height with separate inductor components. This dimensional optimization reduces module volume while preserving electrical and thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables more efficient use of space, leading to smaller and thinner power module designs with enhanced heat dissipation and electrical performance, addressing the limitations of traditional modules by optimizing the placement and encapsulation of inductive and non-inductive elements.
Implementation Method 1
an encapsulation body with magnetic properties for inductive elements
Implementation Method 2
magnetic particles such as carbonyl iron powder
Implementation Method 3
utilizing materials like epoxy resin, phenolic resin, and magnetic particles
Data Source
AI summary
A module structure can include a first type structure including a first encapsulation body having a magnetic property, and at least one inductive element, where at least part of the inductive element is encapsulated in the first encapsulation body; a second type structure including a second encapsulation body having a non-magnetic property, and at least one non-inductive element, where the non-inductive element is encapsulated in the second encapsulation body; and pin structures located on exposed surfaces of the first type structure and/or the second type structure, in order to lead out corresponding electrodes.