Magnetic Particle Epoxy Composition for Low-Loss PCB Embedding
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Solution Overview
Problem
Magnetic particle-containing cured substances used in electronic components often exhibit low magnetic permeability and high magnetic loss, and lack excellent embedding suitability, particularly when used for filling holes in circuit boards.
Innovation Solution
A composition comprising magnetic particles with an Fe atom content of 70% or more, a peak top in the particle size distribution curve between 10 to 30 μm, and a content of 70% to 90% by mass, along with an epoxy resin, reactive diluent, and curing agent, which enhances magnetic permeability and reduces magnetic loss while improving embedding suitability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If magnetic particles with conventional specifications are used in the composition, then the composition can be manufactured with standard materials, but the resulting cured substance exhibits low magnetic permeability and high magnetic loss
Solution Approach 1:
The patent changes the particle size parameter of magnetic particles to have a peak top in the range of 10 to 30 μm in the volume-based frequency distribution. This specific parameter change optimizes the magnetic permeability and reduces magnetic loss by improving particle packing density and reducing air gaps in the cured substance.
Solution Approach 2:
The patent uses a composite material system consisting of magnetic particles combined with a specific resin matrix. The magnetic particles with optimized size distribution are embedded in the resin to form a composite cured substance that achieves both high magnetic permeability and low magnetic loss through the synergistic effect of the constituents.
2Reliability
If the composition is optimized for magnetic performance, then magnetic permeability improves, but embedding suitability for filling holes in circuit boards deteriorates
Solution Approach 1:
The patent applies local quality by having a specific particle size distribution (peak top 10-30 μm) that optimizes different regions of the material structure. The controlled size distribution ensures that smaller particles fill gaps between larger particles, improving both magnetic performance and flow characteristics for better embedding into circuit board holes.
Solution Approach 2:
The patent changes the particle size parameter to a specific range (peak top 10-30 μm) that balances magnetic performance and processability. This parameter optimization ensures the composition has appropriate viscosity and flow characteristics for filling holes while maintaining high magnetic permeability in the cured state.
3Reliability
If magnetic particle content is increased to improve magnetic permeability, then magnetic performance improves, but the composition becomes more difficult to process and embed
Solution Approach 1:
The patent optimizes the particle size parameter (peak top 10-30 μm) to achieve a balance between magnetic particle content and processability. The controlled size distribution prevents excessive viscosity increase even at high magnetic particle concentrations, maintaining ease of embedding while maximizing magnetic permeability.
Solution Approach 2:
The patent uses a composite material formulation where magnetic particles are combined with a resin matrix in optimized proportions. This composite structure allows high magnetic particle content (70-90% by mass) while the resin provides lubrication and flow characteristics that maintain embedding suitability.
Data Source
AI summary
An object of the present invention is to provide a composition that is capable of forming a magnetic particle-containing cured substance having a high magnetic permeability and a low magnetic loss, and has excellent embedding suitability. Another object of the present invention is to provide a magnetic particle-containing cured substance and an electronic component.The composition according to an embodiment of the present invention is a composition containing magnetic particles that has an Fe atom content of 70% by mass or more and an epoxy resin, in which the magnetic particles have a peak top in a range of 10 to 30 μm in a particle size distribution curve showing a volume-based frequency distribution, and a content of the magnetic particles is 70% to 90% by mass with respect to a total solid content in the composition.