Magnetic Field Coupling Element for Antenna Devices
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Solution Overview
Problem
Existing antenna devices face challenges in achieving a high coupling coefficient while minimizing inductance, which affects the radiation characteristics and frequency band broadening due to the large inductance component of transformers used in magnetic field coupling elements.
Innovation Solution
A magnetic field coupling element with a configuration of conductor patterns on multiple layers with interlayer connection conductors, where the first and second coils are positioned to reduce inductance and increase coupling coefficient, and additional features like capacitance formation conductor patterns for impedance matching and downsizing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the number of turns of the first coil and the second coil is increased to increase the coupling coefficient, then the coupling coefficient is improved, but the inductance component of the transformer increases, degrading radiation characteristics
Solution Approach 1:
The patent transitions from planar conductor patterns to three-dimensional stacked conductor patterns across multiple layers. By arranging conductor patterns L11-L14 and L21-L24 across four stacked insulating materials, the invention achieves stronger magnetic field coupling and higher coupling coefficient while reducing the inductance component through vertical stacking rather than horizontal expansion.
Solution Approach 2:
The conductor patterns are nested within a multi-layer insulating structure where insulating materials S11-S24 are stacked sequentially. Each conductor pattern is embedded between specific insulating layers, creating a compact nested configuration that enhances coupling while minimizing the overall inductance footprint.
2Object-generated harmful factors
If the number of turns of the coils is decreased to reduce the inductance component, then the inductance is reduced, but the coupling coefficient between the coils is decreased, reducing the effectiveness of the coupling degree adjustment circuit
Solution Approach 1:
The invention achieves reduced inductance with maintained coupling by transitioning to vertical stacking across multiple insulating layers. The conductor patterns are arranged in three dimensions across insulating materials S11-S24, allowing compact configurations that reduce inductance while the close vertical proximity maintains strong magnetic coupling.
Solution Approach 2:
The patent changes the physical arrangement parameters by stacking conductor patterns across multiple insulating layers with specific thicknesses (e.g., S11: 0.2mm, S12: 0.3mm). This parameter optimization allows reduction of inductance while maintaining coupling coefficient through controlled spatial relationships between adjacent conductor patterns.
3Shape
If conductor patterns are arranged to increase coupling coefficient, then coupling is improved, but device complexity increases due to multiple layers and interlayer connections
Solution Approach 1:
The invention merges multiple functions into a single integrated multi-layer structure. The insulating materials S11-S24 simultaneously provide electrical insulation, mechanical support, and spatial organization for the conductor patterns. The stacked configuration combines coupling functionality with impedance matching capabilities in one integrated assembly.
Solution Approach 2:
The conductor patterns serve multiple functions: they provide magnetic field coupling between primary and secondary coils, establish impedance matching through their geometric configurations, and define the overall device footprint. The multi-layer insulating structure simultaneously provides insulation, mechanical support, and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the coupling coefficient between coils, reduces unnecessary coupling, and broadens the frequency band, improving communication characteristics and signal intensity while maintaining a compact design.
Implementation Method 1
a first coil (L1) and a second coil (L2) which generate magnetic fields that couple with each other
Data Source
AI summary
A magnetic field coupling element includes conductor patterns stacked with insulating layers interposed therebetween, and interlayer connection conductors that inter-connect the conductor patterns at predetermined positions. The conductor patterns include first, second, third, and fourth conductor patterns, and the interlayer connection conductors include first and second interlayer connection conductors. The first conductor pattern, the second conductor pattern, and the first interlayer connection conductor define a first coil, and the third conductor pattern, the fourth conductor pattern, and the second interlayer connection conductor define a second coil. The first coil and the second coil are disposed in a region of less than about ⅓ of a stacking height of a multi-layer body including the insulating layers.