Integrated Magnetic Field Sensor in Power Semiconductor Package
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Solution Overview
Problem
Conventional power semiconductor packages face challenges in achieving accurate current and temperature measurements, with external sensors being complex and precise but costly, and integrated electrical-type sensors offering poor accuracy that requires calibration, increasing complexity and cost.
Innovation Solution
Integration of a magnetic field sensor, such as a magnetoresistive or Hall sensor, within the power semiconductor package to generate a signal proportional to current flow, allowing for precise current and temperature measurement without the need for external components or costly calibration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external components such as resistive shunts are used for current measurement, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent combines the magnetic field sensor and temperature sensor into a single integrated sensing system within the power package, eliminating the need for separate external resistive shunts. The magnetic field sensor detects current through magnetic field interaction with the current pathway, while the temperature sensor monitors thermal conditions, providing multiple measurement functions from integrated components.
2Device complexity
If electrical-type sensors are integrated in the power semiconductor die, then device complexity is reduced, but measurement precision deteriorates
Solution Approach 1:
The patent replaces electrical-type sensors with a magnetic field sensor that operates on magnetic field interaction principles. The magnetic field sensor detects current by sensing the magnetic field generated by current flow in the power semiconductor die's current pathway, rather than using electrical connections that require calibration. This substitution maintains integration benefits while achieving higher measurement accuracy.
3Measurement precision
If customer calibration is performed to improve sense accuracy, then measurement precision is improved, but loss of time increases
Solution Approach 1:
The magnetic field sensor provides calibration-free operation by detecting current through magnetic field interaction with the current pathway. The sensor naturally responds to the magnetic field generated by current flow without requiring external calibration procedures, eliminating the time-consuming calibration step while maintaining high measurement accuracy.
4Reliability
If safety margin or shut down feature is implemented, then reliability is improved, but productivity decreases
Solution Approach 1:
The integrated magnetic field sensor and temperature sensor provide real-time feedback on current and thermal conditions within the power package. This feedback enables precise monitoring of operating parameters, allowing the system to maintain reliable operation through accurate measurement rather than conservative safety margins, thereby improving productivity by reducing unnecessary operational restrictions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The magnetic field sensor provides accurate and simultaneous measurement of current and temperature, reducing package complexity and cost by eliminating the need for external sensors and calibration efforts, while ensuring reliable operation of power semiconductor devices.
Implementation Method 1
The magnetic field sensor is operable to generate a signal in response to a magnetic field produced by current flowing in the current pathway, the magnitude of the signal being proportional to the amount of current flowing in the current pathway
Implementation Method 2
Integration of a magnetic field sensor, such as a magnetoresistive or Hall sensor, within the power semiconductor package
Implementation Method 3
Integration of a magnetic field sensor, such as a magnetoresistive or Hall sensor, within the power semiconductor package
Data Source
AI summary
A power semiconductor package includes a substrate having a plurality of metal leads, a power semiconductor die attached to a first one of the leads and a magnetic field sensor integrated in the same power semiconductor package as the power semiconductor die and positioned in close proximity to a current pathway of the power semiconductor die. The magnetic field sensor is operable to generate a signal in response to a magnetic field produced by current flowing in the current pathway, the magnitude of the signal being proportional to the amount of current flowing in the current pathway.


