Semiconductor Package With Magnetic Material-Filled Inductor Winding
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Solution Overview
Problem
Semiconductor packages with integrated inductors become large and expensive due to the need for sophisticated designs and materials, making them costly and bulky, while consumers seek smaller, more affordable devices with increased functionality.
Innovation Solution
A semiconductor package design that incorporates a magnetic material-filled winding core within the inductor, using a polymer-based encapsulation material with magnetic particles, and an electrical redistribution structure to reduce size and cost, while maintaining functionality, by integrating the inductor directly into the semiconductor chip or attaching it externally with wire-bonded coil windings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If inductors are coupled to chips and embedded in packages, then functionality is improved, but package size and cost increase
Solution Approach 1:
The patent combines the inductor and semiconductor chip into a single integrated structure. The inductor is formed directly on the chip substrate using conductive layers and magnetic material, eliminating the need for separate inductor components and their associated packaging. This merging reduces overall package size while maintaining the required functionality.
Solution Approach 2:
The inductor structure is nested within the chip package footprint. The magnetic material is positioned between the conductive windings and the chip, with the entire inductor structure contained within the package boundaries. This nested arrangement allows the inductor to occupy space that would otherwise be empty or require separate external components.
2Adaptability or versatility
If inductors are coupled to chips and embedded in packages, then functionality is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The inductor is constructed using segmented conductive layers formed through standard semiconductor fabrication processes. Multiple conductive layers are deposited and patterned separately, then connected to form the complete inductor winding. This segmentation allows the use of existing manufacturing tools and processes rather than requiring new complex assembly techniques.
Solution Approach 2:
The patent uses magnetic material with specific permeability parameters to achieve the desired inductance value. By controlling the magnetic permeability and the geometry of the conductive layers, the inductor characteristics are tuned using standard material parameter selection rather than complex structural designs.
3Reliability
If magnetic material is used to fill winding core space, then inductance is improved, but manufacturing complexity increases
Solution Approach 1:
The magnetic material is applied to the chip substrate before the conductive windings are formed. This preliminary positioning allows the magnetic material to serve as a foundation for subsequent winding deposition and simplifies the overall manufacturing sequence. The magnetic material is prepared in advance as part of the chip fabrication process rather than being added later as a separate step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of smaller, more cost-effective semiconductor packages with enhanced functionality by utilizing a magnetic material-filled winding core and an electrical redistribution structure, addressing the size and cost challenges of traditional designs.
Implementation Method 1
A space within the at least one winding is filled with a magnetic material
Implementation Method 2
using a polymer-based encapsulation material with magnetic particles
Data Source
AI summary
A semiconductor package includes a semiconductor chip, an inductor applied to the semiconductor chip. The inductor includes at least one winding. A space within the at least one winding is filled with a magnetic material.