Non-Uniform Magnetic Foil in Component Carriers for EMI Shielding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Component carriers with increasing miniaturization and functionality face challenges in efficiently managing electromagnetic interference (EMI) while maintaining mechanical robustness and electrical reliability, especially under harsh conditions.
Innovation Solution
A component carrier is manufactured with a stack of electrically insulating and conductive layer structures, incorporating a non-uniform magnetic foil that is embedded and patterned to provide effective electromagnetic shielding and mechanical stability, allowing for precise adjustment of magnetic and electric functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If uniform magnetic foil is used in component carrier, then electromagnetic shielding is provided, but mechanical stability and electrical reliability are compromised
Solution Approach 1:
The magnetic foil is designed with non-uniform thickness, creating regions of varying magnetic permeability. Thicker regions provide enhanced EMI shielding where needed, while thinner regions maintain mechanical flexibility and allow for better integration with circuit traces. This local variation in quality optimizes both shielding effectiveness and mechanical/electrical performance.
Solution Approach 2:
The magnetic foil is divided into multiple discrete regions or zones with different thicknesses and magnetic properties, rather than using a uniform structure. This segmentation allows different portions of the foil to serve different functions - some areas optimized for shielding, others for mechanical support or electrical connectivity, thereby resolving the contradiction between shielding effectiveness and reliability.
2Adaptability or versatility
If component carrier functionality is increased with more contacts and smaller spacing, then higher functionality is achieved, but electromagnetic interference protection becomes more difficult
Solution Approach 1:
The magnetic foil incorporates localized high-permeability regions positioned strategically around sensitive high-density contact areas and signal paths. These localized magnetic shielding zones provide targeted EMI protection where the increased functionality creates vulnerability, without requiring uniform shielding across the entire component carrier.
Solution Approach 2:
The magnetic foil transitions from a traditional planar two-dimensional structure to a three-dimensional non-uniform structure with varying thickness. This dimensional change allows the foil to provide EMI shielding in multiple directions and planes, effectively protecting the high-density contacts from interference while maintaining the required functionality.
3Strength
If non-uniform magnetic foil is used, then EMI shielding and mechanical stability are improved, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process controls the thickness parameter of the magnetic foil to vary in a predetermined non-uniform pattern. By establishing specific thickness ranges for different regions during fabrication, the process achieves the desired non-uniform magnetic properties while maintaining manufacturability through parameter specification rather than complex post-processing.
Solution Approach 2:
The non-uniform thickness pattern of the magnetic foil is predetermined and established during the foil manufacturing stage before integration into the component carrier. This preliminary action creates the functional gradient in advance, simplifying the subsequent assembly process and reducing manufacturing complexity at the integration stage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI, enhances mechanical stability, and supports high functionality and reliability of component carriers, even under harsh conditions, by utilizing a non-uniform magnetic foil integrated within the stack of electrically insulating and conductive layers.
Implementation Method 1
the non-uniform magnetic foil may at least partially surround an electromagnetic radiation emitting and/or electromagnetic radiation sensitive component embedded in the component carrier to reduce or even eliminate issues concerning electromagnetic interference (EMI)
Implementation Method 2
the non-uniform magnetic foil forms part of an inductor, for instance constitutes a ferrite core cooperating with a coil integrated in a component carrier
Data Source
Figure 1~6
Figure 7~12
Figure 13~20
AI summary
A component carrier (100), wherein the component carrier (100) comprises a stack (102) comprising a plurality of electrically insulating layer structures (104) and/or a plurality of electrically conductive layer structures (106), and a non-uniform magnetic foil (108) integrated in the stack (102).