Magnetic Gap Thermal Insulation for Aircraft Electronics

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Solution Overview

Problem

Aircraft electronics face significant thermal challenges during hypersonic flight due to aerodynamic heating, where leading surfaces can exceed 1000 degrees Celsius, posing a risk of heat transfer to sensitive components.

Innovation Solution

A thermal insulation system utilizing magnets to generate opposing magnetic fields, creating a gap between high-temperature leading surfaces and temperature-sensitive electronics, thereby reducing heat transfer through the use of a carrier and container with embedded magnets and an optional coolant or IR reflective coating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If leading surfaces are exposed to hypersonic flight conditions, then aerodynamic heating occurs and temperatures exceed 1000 degrees Celsius, but heat transfers to electronics causing thermal damage

Engineering Contradiction:
Improvetemperature of leading surfacesVSAvoidheat transfer to electronics
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent introduces magnetic fields as an intermediary between the hot leading surfaces and the electronics. The first magnetic field from the carrier and the second magnetic field from the container create a magnetic gap that acts as a thermal barrier, preventing direct heat transfer while allowing the system to withstand hypersonic temperatures.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces traditional mechanical thermal insulation structures with a magnetic field-based solution. Instead of using thick insulating materials or complex mechanical barriers, the system uses opposing magnetic fields to create a non-contact thermal barrier, substituting mechanical design with electromagnetic field control.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Object-affected harmful factors

If traditional thermal insulation materials are used between leading surfaces and electronics, then heat transfer is reduced, but device complexity and weight increase

Engineering Contradiction:
Improveheat transfer reductionVSAvoidinsulation system complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent replaces traditional mechanical thermal insulation materials with a magnetic field-based barrier. This substitution eliminates the need for thick insulating layers and complex thermal management structures, reducing overall system complexity while maintaining effective heat transfer reduction.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the physical state and properties of the gap between carrier and container by applying magnetic fields. The magnetic fields alter the thermal conductivity parameter of the gap region, creating a thermal barrier without requiring physical insulation materials, thereby simplifying the system design.

Inventive Principle:
Principle #35Parameter changes

3Object-affected harmful factors

If a gap is created between carrier and container, then heat transfer is reduced, but structural stability and thermal coupling are compromised

Engineering Contradiction:
Improveheat transfer reductionVSAvoidstructural stability
Core Design Contradiction:
Object-affected harmful factorsVSStability of the object's composition

Solution Approach 1:

The patent creates a dynamic system where the gap between carrier and container is maintained by active magnetic field control rather than fixed mechanical structures. The magnetic fields can be adjusted to maintain the optimal gap distance, providing both thermal isolation and structural flexibility, allowing the system to adapt to different thermal conditions while maintaining stability.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively mitigates heat transfer from high-temperature leading surfaces to electronics, protecting them from excessive heating during hypersonic flight by maintaining a controlled gap and potentially using a coolant or IR reflective coating to further reduce thermal impact.

Implementation Method 1

a first plurality of magnets that generate a first magnetic field, and an exterior surface that thermally couples to the leading surfaces of the aircraft

Methodology Applied
Scientific EffectMagnetic field: Magnetic Field

Implementation Method 2

The first magnetic field and the second magnetic field generate a gap between the interior surface of the carrier and the exterior surface of the container

Methodology Applied
Scientific EffectMagnetic repulsion: Ion Repulsion/Attraction

Implementation Method 3

an exterior surface that thermally couples to the leading surfaces of the aircraft

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 4

an optional coolant or IR reflective coating

Methodology Applied
Scientific EffectInfrared radiation reflection: Reflection

Data Source

PatentUS9758235B2Thermal insulation system, aircraft, and vehicle having same
Publication Date: 2017.09.12 THE BOEING CO
  • US9758235B2 patent drawing
  • US9758235B2 patent drawing
  • US9758235B2 patent drawing

AI summary

A thermal insulation system for an aircraft that includes leading surfaces is provided. The thermal insulation system includes a carrier and a container. The carrier has an interior surface that includes a first plurality of magnets that generate a first magnetic field, and an exterior surface that is thermally coupled to the leading surfaces of the aircraft. The container is surrounded by the interior surface of the carrier, has an exterior surface including a second plurality of magnets that generate a second magnetic field oriented opposite the first magnetic field, and has an interior that includes electronics. The first magnetic field and the second magnetic field generate a gap between the carrier and the container to reduce a heat transfer from the leading surfaces to the electronics during operation of the aircraft.