Magnetic Gear Substrate Processing Apparatus
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in precisely controlling the rotation speed and maintaining the position of substrates against centrifugal forces during the revolving and rotating motions, leading to potential contamination and process uniformity issues.
Innovation Solution
A substrate processing apparatus is designed with a first disk performing a turning motion and a second disk equipped to perform a revolving and rotating motion, utilizing a magnetic gear system and electrostatic chuck for precise torque control and substrate holding, along with a rotary connector structure for electrical interconnection, to stabilize the substrate and improve process uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If air or gas is used to turn or rotate the second disk, then the second disk can be rotated, but contamination material contained in the air or gas may be adsorbed on the substrate
Solution Approach 1:
The patent replaces the pneumatic/gas-based rotation system with a magnetic field-based system. A magnetic gear mechanism uses magnetic attraction and repulsion forces between permanent magnets arranged on the first disk and corresponding magnets on the second disk to achieve rotation without physical contact or gas injection, thereby eliminating contamination risks while maintaining rotational capability.
2Speed
If the second disk is rotated using conventional methods, then rotation can be achieved, but precise control of rotation speed and position is difficult
Solution Approach 1:
The patent incorporates sensors to detect the position and rotation speed of the second disk, providing real-time feedback to the control system. This feedback mechanism enables precise control of rotation speed and position by continuously monitoring and adjusting the magnetic field strength and timing, ensuring accurate substrate processing.
Solution Approach 2:
The patent controls rotation speed and position by dynamically adjusting magnetic field parameters such as field strength, frequency, and phase. By changing these magnetic parameters, the system achieves precise control over the second disk's rotational characteristics without mechanical contact.
3Productivity
If the substrate is loaded on the rotating second disk, then processing can be performed, but centrifugal force may cause position instability
Solution Approach 1:
The patent employs an electrostatic chuck that generates strong electrostatic attraction forces to hold the substrate firmly against the second disk. This electrostatic holding force counteracts the centrifugal force generated during rotation, maintaining substrate position stability and preventing displacement or contamination even at high rotation speeds.
Solution Approach 2:
The patent replaces mechanical clamping or adhesive methods with electrostatic field-based substrate holding. The electrostatic chuck uses controlled electrostatic forces to secure the substrate, providing stable positioning that effectively resists centrifugal forces during rotation while maintaining substrate integrity and processing quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively stabilizes substrates against centrifugal forces, allowing for precise control of rotation speed and position, thereby enhancing process uniformity and reducing contamination risks during semiconductor fabrication processes.
Implementation Method 1
an electrostatic chuck provided on the second disk and configured to hold a substrate using an electric power supplied through the first rotary connector structure
Implementation Method 2
a first magnetic gear fixed to the second disk and configured to exert a torque on the second disk, and a second magnetic gear provided in the chamber to be interact with the first magnetic gear
Data Source
AI summary
A substrate processing apparatus may include a first disk provided in a chamber and configured to perform a turning motion and to include a plurality of seating holes periodically arranged within a specific radius from a center axis, a plurality of second disks provided in the seating holes, respectively, and configured to perform a revolving and rotating motion in accordance with the turning motion of the first disk, a first rotary connector structure provided between the second disk and the seating hole to allow for a rotating motion of and for an electric connection to the second disk, an electrostatic chuck provided on the second disk and configured to hold a substrate using an electric power supplied through the first rotary connector structure, and a first magnetic gear fixed to the second disk and configured to exert a torque on the second disk, and a second magnetic gear.