Thin Film Magnetic Head Heating Element Heat Dissipation
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Solution Overview
Problem
Existing thin film magnetic heads face challenges in controlling the protrusion of element portions towards the recording medium, leading to deteriorated recording and playback characteristics and potential damage due to excessive peripheral protrusion, as well as local temperature increases in electrode leads causing reliability issues.
Innovation Solution
The design incorporates a pair of electrode leads that function as both wiring patterns for energizing the heating element and heat dissipation plates, with overlapping regions and heat dissipation areas larger than the heating element, embedded in an insulating layer below the coil layer, utilizing materials with higher thermal conductivity to diffuse heat and prevent local temperature increases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If heating elements are used to protrude element portions toward the recording medium side, then playback and recording characteristics are improved, but peripheral protrusion occurs causing contact with the recording medium and deterioration of characteristics
Solution Approach 1:
A heat dissipation plate is introduced as an intermediary component between the heating element and the element portion. The heat dissipation plate absorbs and distributes the heat generated by the heating element, preventing excessive thermal expansion of the peripheral regions while allowing controlled protrusion of the element portion toward the recording medium.
Solution Approach 2:
The heating element and heat dissipation plate are designed with spatially varying properties. The heating element is positioned to provide localized heating to the element portion, while the heat dissipation plate has extended regions that conduct heat away from peripheral areas, creating a non-uniform temperature distribution that enables selective protrusion.
2Manufacturing precision
If heat dissipation plate is disposed to reduce peripheral protrusion, then recording and playback characteristics are maintained, but manufacturing process becomes complicated
Solution Approach 1:
The heat dissipation plate is merged with existing structural components of the magnetic head, such as the slider body or support layers, rather than being implemented as a separate discrete component. This integration allows the heat dissipation function to be achieved while utilizing already-present materials and manufacturing processes.
Solution Approach 2:
Existing structural components of the magnetic head are designed to serve multiple functions: providing mechanical support, enabling thermal conduction for heat dissipation, and maintaining structural integrity. This multi-functionality reduces the need for additional specialized components and simplifies the overall manufacturing process.
3Use of energy by moving object
If electrode lead width is increased to reduce electric resistance, then energization efficiency is improved, but local heat generation occurs causing break and reliability deterioration
Solution Approach 1:
The heat dissipation plate serves as a thermal intermediary that couples with the electrode lead. It provides an additional thermal conduction path that bypasses the electrode lead, carrying heat away from the high-resistance connection regions and preventing localized temperature buildup that would cause material degradation and breaks.
Solution Approach 2:
The thermal management function is shifted from relying solely on the electrode lead's thermal conduction to utilizing the heat dissipation plate's thermal conduction. This substitution allows the electrode lead to focus on its primary electrical function while the heat dissipation plate handles thermal management, reducing thermal stress on the electrode lead.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the peripheral protrusion of element portions, enhances playback and recording performance, and prevents electrode lead failures by efficiently dissipating heat, thereby improving the reliability and performance of the thin film magnetic head.
Implementation Method 1
a heating element which generates heat during energization so as to allow at least one of the playback element and the recording element to protrude toward the recording medium side through thermal expansion
Implementation Method 2
utilizing materials with higher thermal conductivity to diffuse heat and prevent local temperature increases
Data Source
AI summary
A thin film magnetic head is provided, in which the amount of protrusion in the periphery of an element portion can be reduced or a local temperature increase of electrode leads of a heating element can be prevented. The thin film magnetic head includes a playback element disposed between lower and upper shield layers, a recording element laminated on the upper shield layer, a heating element which is disposed below a coil layer and which generates heat to allow the playback element to protrude toward the recording medium side through thermal expansion, and a pair of electrode leads including overlapping regions, which are in contact with rear ends of the heating element and which overlap with the upper shield layer, and heat dissipation regions. Furthermore, connection wiring portions of the pair of electrode leads are disposed in a region sandwiched between the upper shield layer and a magnetic layer.