Magnetic Head Slider Ground Connection Timing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In magnetic data recording, the existing manufacturing processes for sliders are inefficient due to the early determination of which contact pad is grounded, leading to potential shortages and increased costs, as the decision to make a slider 'up' or 'down' must be made at the beginning of the process, limiting yield and flexibility.
Innovation Solution
A slider design with a grounded heater element and an up/down neutral ground connection allows the decision of which contact pad to be grounded to be made late in the manufacturing process, enabling the slider to be configured as either 'up' or 'down' and reducing waste by allowing configuration changes based on yield losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the decision of which contact pad is grounded is made at the beginning of the manufacturing process, then the manufacturing process is simple and straightforward, but the yield efficiency is reduced and manufacturing costs increase due to inability to accommodate yield losses
Solution Approach 1:
The patent applies dynamics by making the ground connection configurable at different stages of manufacturing. The up/down neutral ground connection allows the slider to be dynamically reconfigured from an 'up' configuration to a 'down' configuration based on yield considerations, rather than being statically determined at the beginning of manufacturing
Solution Approach 2:
The patent changes the parameter of ground connection configuration timing from early manufacturing to late manufacturing. By delaying the ground connection decision until after wafer processing, the system can adjust electrical parameters (which contact pad is grounded) based on actual yield outcomes, thereby improving overall manufacturing efficiency
2Ease of manufacture
If the slider configuration is determined early in manufacturing, then the manufacturing process flow is straightforward, but flexibility and adaptability are reduced, limiting the ability to respond to yield losses
Solution Approach 1:
The system transitions from a static configuration determined at the start of manufacturing to a dynamic configuration that can be changed based on yield outcomes. The up/down neutral ground connection enables this dynamic adaptability by allowing reconfiguration of which contact pad is grounded
Solution Approach 2:
The patent creates a universal slider design that can serve both 'up' and 'down' configurations. By incorporating an up/down neutral ground connection, the same slider structure can be adapted to different configuration requirements, increasing versatility and reducing waste
3Productivity
If wafer processing is optimized for a specific slider configuration, then processing efficiency is improved, but yield losses reduce overall productivity due to inability to reuse sliders
Solution Approach 1:
The patent enables recovery of sliders that would otherwise be discarded due to yield losses. By allowing reconfiguration of the ground connection after wafer processing, sliders that fail to meet specifications for one configuration can be repurposed for the opposite configuration, reducing waste
Solution Approach 2:
The system changes the electrical configuration parameter (ground connection assignment) after wafer processing based on yield outcomes. This parameter change allows previously non-conforming sliders to meet specifications for the opposite configuration, thereby reducing waste and improving overall yield
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves yield efficiency by allowing late-stage configuration of sliders, minimizing waste and reducing manufacturing costs by enabling the reuse of 'up' sliders as 'down' sliders if needed, thus optimizing wafer processing.
Implementation Method 1
a heater element formed on the slider body
Data Source
AI summary
A slider structure that allows a grounded heater element to be employed, while also allowing a decision of whether the slider is to be an “up” slider or a “down” slider to be made in a late stage in the formation of the slider. The slider includes electrical contact pads for making electrical connection with the heater element. The slider also includes a dedicated ground path formed on the slider body at a location that is removed from either of the first and second contact pads, ground path providing electrical connectivity to the slider body. At a late stage in the manufacture of the read and write head, a determination can be made as to which contact pad is to be a ground pad, and that pad can be electrically connected with the ground path.


