Magnetic Head Substructure with Embedded Detection Elements for Lapping Precision
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for manufacturing magnetic heads face challenges in accurately forming medium facing surfaces and detecting the position and angle of lapped surfaces relative to the substrate, leading to deviations from desired neck height and track width, which affects the yield and performance of magnetic heads.
Innovation Solution
The method involves a magnetic head substructure with first and second detection elements to monitor the position and angle of the lapped surface, and third and fourth detection elements to precisely detect the distance and angle, allowing for accurate formation of medium facing surfaces even when the lapped surface is away from the target position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional lapping methods are used to form medium facing surfaces, then the manufacturing process is simple, but the position and angle of the lapped surface deviate from the target, resulting in inaccurate neck height and track width
Solution Approach 1:
Detection elements are embedded in the substrate before the lapping process begins. These elements pre-establish reference positions and orientations that will be used throughout the lapping operation to guide the formation of the medium facing surface at the correct position and angle.
Solution Approach 2:
The detection elements provide real-time feedback during the lapping process about the position and angle of the lapped surface relative to the substrate. This feedback enables continuous monitoring and adjustment to ensure the medium facing surface is formed with high precision at the target position and orientation.
2Manufacturing precision
If the lapped surface is formed away from the target position, then the lapping process can be completed, but the neck height and track width become inaccurate, affecting magnetic head performance
Solution Approach 1:
Detection elements serve as intermediaries between the lapping process and the measurement system. These elements are positioned at known locations in the substrate and provide reference points that enable indirect but precise measurement of the lapped surface position and angle without requiring direct measurement of the surface itself.
Solution Approach 2:
The patent replaces complex mechanical measurement systems with detection elements that can be integrated into the substrate. This substitution simplifies the measurement process while improving precision by using electrical or optical detection methods instead of mechanical probing during lapping.
3Measurement precision
If multiple detection elements are added to monitor position and angle, then measurement accuracy improves, but the device complexity and manufacturing cost increase
Solution Approach 1:
The detection elements are designed to serve multiple functions: they detect position, detect angle, and provide reference information for both the lapping process and subsequent manufacturing steps. This multi-functionality reduces the need for separate detection systems for each measurement task.
Solution Approach 2:
Multiple detection functions are merged into a single integrated detection element structure embedded in the substrate. Rather than using separate sensors for position and angle measurements, the patent combines these functions into unified detection elements that provide comprehensive measurement capability with minimal additional complexity.
Data Source
AI summary
Components of a plurality of magnetic heads are formed on a single substrate to fabricate a magnetic head substructure in which a plurality of pre-head portions are aligned in a plurality of rows. The substructure is cut to separate the plurality of pre-head portions from one another, and the plurality of magnetic heads are thereby fabricated. The surface formed by cutting the substructure is lapped to form a lapped surface. The lapped surface is lapped so as to reach a target position of a medium facing surface. The substructure incorporates first to fourth resistor elements each of which detects the position of the lapped surface. The third and fourth detection elements are located at positions shifted from the first and second resistor elements along the direction orthogonal to the medium facing surface.