Magnetically Coupled Heat Pipe Plate for Adaptive Cooling
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Solution Overview
Problem
Existing loop type heat pipes lack the ability to dynamically adjust heat dissipation performance in response to varying use situations and environments, limiting their adaptability and efficiency in cooling heat-generating components.
Innovation Solution
Incorporating a first magnet in the loop type heat pipe and a second magnet in the heat dissipation plate, with a support member that allows the heat dissipation plate to move relative to the heat pipe in response to changes in magnetic force, thereby varying the thermal connection and enhancing heat dissipation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the heat dissipation plate is fixed to the heat pipe, then the structure is simple and reliable, but the heat dissipation performance cannot be adjusted according to different use situations
Solution Approach 1:
The heat dissipation plate is designed to be movable relative to the heat pipe through a support member, allowing the system to dynamically adjust thermal connection based on operating conditions. The plate can transition between connected and disconnected states to optimize heat dissipation performance for different heat input scenarios.
Solution Approach 2:
The system changes the thermal conductivity parameter between the heat pipe and heat dissipation plate by controlling their relative position. When connected, thermal conductivity is high; when disconnected, thermal conductivity is low. This parameter change enables adaptation to varying heat dissipation requirements.
2Productivity
If continuous cooling is applied, then high heat dissipation performance is maintained, but excessive cooling occurs in low heat input scenarios leading to energy waste
Solution Approach 1:
The movable heat dissipation plate enables dynamic control of the cooling system. In high heat input scenarios, the plate connects to the heat pipe for active cooling. In low heat input scenarios, the plate disconnects to prevent excessive cooling and energy waste, achieving adaptive cooling performance.
Solution Approach 2:
The system uses the temperature-dependent magnetic force changes of the first magnet to automatically control the connection state of the heat dissipation plate without external control systems. The magnet's magnetic force naturally decreases at high temperatures, causing the plate to connect for cooling, and increases at low temperatures, causing disconnection,实现ing self-regulating cooling.
3Loss of energy
If the heat dissipation plate is disconnected from the heat pipe, then energy is saved in low heat input scenarios, but heat dissipation performance deteriorates in high heat input scenarios
Solution Approach 1:
The system dynamically adjusts the connection state between the heat dissipation plate and heat pipe based on thermal conditions. The support member allows the plate to move between disconnected (energy saving) and connected (high heat dissipation) states, optimizing the balance between energy efficiency and cooling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for adaptive heat dissipation performance by disconnecting or connecting the heat dissipation plate from the heat pipe based on magnetic force changes, optimizing cooling efficiency in both low and high heat input scenarios, and reducing excessive cooling or heating.
Implementation Method 1
a support member that movably supports the heat dissipation plate so that a distance between the loop type heat pipe and the heat dissipation plate can be varied in response to a change in magnetic force of the first magnet
Implementation Method 2
a heat pipe configured to transport heat by using a phase change of a working fluid
Implementation Method 3
a loop type heat pipe including an evaporator configured to vaporize a working fluid by heat of a heat-generating component and a condenser configured to cool and condense the vaporized working fluid
Implementation Method 4
a heat dissipation plate thermally connectable to the loop type heat pipe
Data Source
Figure 1A~1B
Figure 2
Figure 3
AI summary
An electronic device includes a loop type heat pipe (10) including a loop-shaped flow path (15, 13r) in which a working fluid is enclosed, a first magnet (50) provided to the loop type heat pipe (10), a heat dissipation plate (30) thermally connectable to the loop type heat pipe (10), a second magnet (60) provided to the heat dissipation plate (30) and provided to face the first magnet (50), and a support member (40) that supports the heat dissipation plate (30) movably between a position in which the heat dissipation plate (30) is thermally connected to the loop type heat pipe (10) and a position in which the heat dissipation plate (30) is not thermally connected to the loop type heat pipe (10).