Magnetic Component Heat Sink Layout for Coil and Core Cooling
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Solution Overview
Problem
Magnetic components in power modules, such as transformers and inductors, face poor heat dissipation due to low thermal conductivity of thermally conductive adhesives and bakelite materials, leading to inefficient heat transfer from the magnetic core and coils.
Innovation Solution
Incorporating a heat sink between adjacent coils and the magnetic core, and using T-shaped or L-shaped heat sinks to enhance thermal contact and shorten the heat dissipation path, thereby improving the thermal conductivity and heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermally conductive adhesive is used to transfer heat from magnetic component to liquid cooling cavity, then heat dissipation is achieved, but thermal resistance is high due to low thermal conductivity of adhesive
Solution Approach 1:
The patent introduces a heat sink as an intermediary component between the magnetic core and the thermally conductive adhesive. The heat sink with high thermal conductivity material serves as a mediator to improve heat transfer efficiency, reducing the thermal resistance that would otherwise be caused by the low conductivity adhesive alone.
Solution Approach 2:
The patent creates a composite heat dissipation structure combining multiple materials: the magnetic core, thermally conductive adhesive, and heat sink made of high thermal conductivity material. This composite structure leverages the advantages of each material to achieve better overall thermal performance than any single material could provide.
2Strength
If bakelite bobbin is used to cover magnetic core, then structural support is provided, but thermal conductivity is poor preventing direct contact between magnetic core and thermally conductive adhesive
Solution Approach 1:
The heat sink acts as an intermediary that bridges the gap created by the bakelite bobbin. It provides a thermal conduction path from the magnetic core through the adhesive to the cooling cavity, overcoming the thermal barrier introduced by the bakelite material.
3Temperature
If heat sink is inserted between coils and magnetic core, then heat dissipation path is shortened, but device complexity increases
Solution Approach 1:
The patent merges the heat sink integration into the existing coil assembly structure. The heat sink is positioned to simultaneously contact multiple coils and the magnetic core, combining multiple heat dissipation functions into a single component rather than adding separate heat dissipation elements for each component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal resistance and enhances the heat dissipation effect of magnetic components by up to 15 degrees Celsius, improving the overall cooling capacity and heat transfer efficiency.
Implementation Method 1
the heat generated by the magnetic component is transferred to the liquid cooling cavity by virtue of the thermally conductive adhesive
Data Source
AI summary
The present disclosure provides a magnetic component and a power module, relating to the technical field of power electronics; the magnetic component provided by the present disclosure includes: a first heat sink, a magnetic core extending in a transverse direction and a winding structure wound on the magnetic core, the winding structure includes at least a first coil and a second coil arranged adjacently along the transverse direction, a gap is provided between the first coil and the second coil, at least part of the first heat sink is arranged in the gap, the first heat sink is in thermal contact with the first coil, the second coil and the magnetic core.