Magnetic Heat Spreader Mounting for PCB Thermal Expansion Stress
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Thermal expansion of structures in integrated circuit devices imposes stresses on printed wiring boards and electrical connections, leading to potential damage and reduced lifespan of components.
Innovation Solution
The use of magnetic connectors between heat management structures and printed wiring boards, which allow for lateral slippage of posts during thermal expansion, reducing stress on electrical bumps and the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If rigid mechanical connectors are used between heat spreaders and printed wiring boards, then structural stability is improved, but thermal expansion stress damages electrical connections and reduces component lifespan
Solution Approach 1:
The patent applies the dynamics principle by transitioning from rigid fixed mechanical connectors to magnetic connectors that enable controlled lateral movement. The magnetic connectors provide a dynamic connection that allows heat spreaders to expand and contract thermally while maintaining electrical connectivity, thus resolving the contradiction between structural stability and component reliability during thermal cycling.
Solution Approach 2:
The patent employs parameter changes by altering the mechanical properties of the connector from rigid to flexible through magnetic attraction forces. This allows the connection to accommodate dimensional changes in the heat spreader during thermal expansion, maintaining both structural integrity and electrical connection reliability across temperature variations.
2Strength
If fixed mechanical attachments are used to secure heat spreaders, then attachment strength is improved, but stress on electrical bumps increases during thermal expansion
Solution Approach 1:
The magnetic connectors provide a dynamic attachment system that maintains strong holding force while allowing controlled movement. The magnetic force maintains attachment strength to secure the heat spreader, while simultaneously permitting lateral slippage that reduces stress concentration on electrical bumps during thermal expansion cycles.
Solution Approach 2:
The magnetic connectors act as a cushioning mechanism that anticipates and accommodates thermal expansion before excessive stress develops. The flexible magnetic connection absorbs expansion stresses progressively, preventing sudden stress peaks that could damage electrical bumps, thus protecting the system in advance during thermal cycling.
3Strength
If rigid connections are used between heat management structures and boards, then structural integrity is improved, but lateral slippage during thermal expansion causes damage
Solution Approach 1:
The patent resolves this contradiction by implementing dynamic magnetic connectors that maintain structural integrity through magnetic attraction while enabling controlled lateral slippage. This dynamic connection allows the heat management structure to expand and contract without causing damage, preserving both strength and protecting against thermal expansion harm.
Solution Approach 2:
The magnetic connector changes the mechanical parameter of connection rigidity from fixed to flexible, allowing the system to accommodate thermal expansion parameters. This parameter change enables the connection to maintain integrity while adapting to dimensional changes, preventing damage from rigid constraints during thermal cycling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces thermal-expansion stress on electrical connections and the printed wiring board, extending the service life of components by allowing for controlled movement of heat spreader components.
Implementation Method 1
magnet structures associated with the printed wiring board. The magnet structures impose a magnetic attraction force upon the ferromagnetic posts, thereby coupling the heat spreader to the printed wiring board
Implementation Method 2
a heat spreader overlying and in thermal communication with the microelectronic device component
Data Source
AI summary
A printed wiring board assembly is disclosed that includes a printed wiring board with a first side and a second side opposite first side. Magnet structures are in physical contact with the printed wiring board and a microelectronic device component is coupled to the first side of the printed wiring board. A heat spreader overlies and is in thermal communication with the microelectronic device component, and posts are coupled to the heat spreader and horizontally neighbor the microelectronic device component, where the posts are in magnetic communication with the magnet structures. Related methods and electronic systems are also disclosed.