Magnetically Affixed Heat Spreader for Thin PCBs

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Solution Overview

Problem

Conventional heat spreader designs for central processing units (CPUs) and system-on-a-chip (SoCs) require mechanical assembly and through holes in the printed circuit board (PCB), which occupy valuable space, increase costs, and complicate thermal management due to the need for mechanical stiffeners, especially as devices become thinner and space becomes a premium.

Innovation Solution

A magnetically affixed heat spreader using an array of small neodymium magnets around the periphery to attract a passively magnetic mechanical stiffener, eliminating the need for through holes and mechanical assembly, thereby simplifying assembly and reducing the vertical profile.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If mechanical assembly methods with through holes are used to affix heat spreaders, then reliable thermal contact is achieved, but PCB space is occupied, assembly complexity increases, and costs increase

Engineering Contradiction:

Improvethermal contact reliabilityVSAvoidassembly complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces mechanical fastening systems (screws, clips, through-holes) with a magnetic field-based attachment system. Magnets embedded in the heat spreader substrate attract and hold the heat spreader against the processing element through magnetic attraction, eliminating the need for mechanical assembly components and through-holes in the PCB.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent removes the mechanical fastening components and through-holes from the assembly, extracting only the essential function of securing the heat spreader. The magnetic attachment system achieves reliable thermal contact without requiring physical penetration of the PCB or additional mechanical fasteners.

Inventive Principle:

Principle #2Taking out (Extraction)

2Stability of the object's composition

If mechanical stiffeners are added to support heat spreaders, then structural stability is improved, but vertical profile increases and space is consumed

Engineering Contradiction:

Improvestructural stabilityVSAvoidvertical profile

Core Design Contradiction:

Stability of the object's compositionVSLength of stationary object

Solution Approach 1:

The heat spreader substrate performs multiple functions simultaneously: it conducts heat from the processing element, provides structural support through its own rigidity, and generates magnetic attraction for attachment. This eliminates the need for separate mechanical stiffener components, reducing the vertical profile while maintaining structural stability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines the functions of heat conduction, structural support, and magnetic attachment into a single integrated heat spreader substrate. The substrate itself provides the necessary structural rigidity and contains the magnetic elements, merging what were previously separate components into one unified structure.

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If through holes are drilled in PCB for mechanical assembly, then heat spreader attachment is achieved, but PCB routing constraints increase and valuable space is occupied

Engineering Contradiction:

Improveheat spreader attachmentVSAvoidPCB space

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The magnetic attachment system replaces mechanical fastening that requires PCB through-holes. The magnets in the heat spreader substrate create magnetic attraction that secures the assembly without requiring any holes or openings in the PCB, preserving all PCB real estate for routing and component placement.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution achieves effective heat dissipation comparable to mechanical affixation methods while minimizing PCB routing constraints, reducing costs, and providing a lower z-profile, thus enhancing thermal management and system flexibility.

Implementation Method 1

A magnetically affixed heat spreader using an array of small neodymium magnets around the periphery to attract a passively magnetic mechanical stiffener

Methodology Applied

Scientific EffectMagnetic attraction: Magnetism

Implementation Method 2

cold plate disposed to conduct heat away from the active computing element

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS11145568B2Magnetically affixed heat spreader

Publication Date: 2021.10.12 INTEL CORP

AI summary

There is disclosed in one example a computing apparatus, including: an active computing element; a first magnetic attractor mechanically coupled to the active computing element; and a cold plate disposed to conduct heat away from the active computing element, the cold plate including a second magnetic attractor disposed to magnetically couple with the first magnetic attractor.