Magnetic Heat Sink Loading Assembly for PCB Sag Resistance
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Solution Overview
Problem
The increasing heat dissipation and input/output (I/O) requirements of leading edge semiconductor chips pose challenges in keeping heat sinks securely fixed in place, particularly due to the higher mass of heat sinks which can cause PCB bending or sagging and increased sensitivity to movement.
Innovation Solution
The introduction of magnetic forces to prevent vertical movement of the heat sink by using a backplate with a magnetic layer facing a magnetic system chassis, creating an attractive force that inhibits heat sink movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sink mass is increased to meet cooling requirements, then heat dissipation capability is improved, but PCB bending or sagging occurs under the weight
Solution Approach 1:
The patent introduces a loading frame structure that acts as a mechanical counterweight system to support the heat sink weight. The loading frame includes a loading plate positioned to bear the weight of the heat sink, transferring the load away from the PCB to a dedicated support structure, thereby preventing PCB bending while allowing the heat sink to maintain its high mass for effective cooling
2Temperature
If heat sink mass is increased to meet cooling requirements, then heat dissipation capability is improved, but heat sink movement increases sensitivity
Solution Approach 1:
The loading frame structure provides mechanical support that counteracts gravitational forces on the heat sink, preventing vertical movement. The loading plate and support members create a rigid assembly that holds the heat sink firmly in position, eliminating excessive movement sensitivity while maintaining the high mass required for effective heat dissipation
3Strength
If loading frame is mounted to system chassis, then heat sink weight is supported, but I/O damage risk increases due to movement
Solution Approach 1:
The patent implements a nested structure where the loading frame is integrated with the backplate that is already attached to the PCB. The loading plate is positioned within the backplate structure, and the heat sink is mounted on the loading frame. This nested arrangement ensures that the heat sink movement is constrained by multiple nested components working together, providing weight support while preventing I/O damage through coordinated structural support
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces vertical movement of the heat sink, thereby protecting I/Os at the package/PCB interface from damage due to physical shocks, while ensuring stable thermal management for high-performance semiconductor chips.
Implementation Method 1
a backplate with a magnetic layer facing a magnetic system chassis, creating an attractive force that inhibits heat sink movement
Data Source
AI summary
An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink.